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There is an increasing need for automated ESD verification tools-especially for analog designs. This work will describe the aspects of analog design that increase verification complexity and will present tool requirements based on these aspects. A new verification tool for analog design will then be presented.
This work presents a CDM circuit-level model for stacked die in a BGA package. Circuit simulation is used to investigate the voltage stress on the die-to-die interface circuits. The power net connections are found to impact the CDM reliability. An ESD protection scheme for the die-to-die interface circuits is proposed.
An analysis of long-duration TLP stress will be performed on ESD clamps representative of the mo commonly used ESD protection strategies. It will be shown that snapback-based High Voltage devices feature static filamentary conduction after triggering. This leads to failure for TLP pulse widths in excess of 100ns, we below the expected power scaling levels. The need for long TLP testing to establish...
On-chip EOS/ESD full-protection for TMR heads can be achieved using shunt diodes that are mounted permanently in the TMR device. This consists of two semiconductor diodes connected in parallel and in reverse order across the reader pads of TMR heads. This method also increases the ESD threshold of the TMR heads.
A commercial ESD testing apparatus was modified with electrical and optical diagnostics to visualize ignited and cold particles ejected from the sample holder, obtain Joule heating energy, measure ignition delays and particle burn times, and correlate results. Experiments determined the fraction of spark energy dissipated in the powder. Several ignition criteria were used to interpret the experimental...
The major issue that negatively impacts today's Field Induced CDM (FICDM) tester repeatability and reproducibility is the air discharge's variable spark resistance. There are many variables that contribute to this measurement uncertainty including humidity, pogo shape, DUT shape, contact alignment, surface cleanliness, approach speed, voltage level and adjacent pin discharges. The air discharge variability...
We present a new ESD compact modeling methodology using Verilog-A to enable predictive full circuit ESD simulation along with supporting hardware and failure analysis results. We also present a new ESD tool (ESTEEM) to automate the ESD design simulation and optimization flow for circuit designers. Test results show excellent simulation to hardware data correlation.
A whole-chip simulation methodology of the full ESD paths including the full-chip power and ground wiring network has been established, and successfully demonstrated on products with several hundreds of pins. By checking voltage stress across cross domain circuits itself, marginal cross domain ESD design window in sub-100nm SoCs can be extended.
This work presents the case study of the response of an audio amplifier IC stressed while powered up. Under these conditions, the discharge current path varies from that in the unpowered circuit. Complete simulations have been performed and compared to measurements to highlight the IC's failure under system ESD stress conditions.
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