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A new tester-induced HBM current waveform anomaly was discovered as a result of efforts to understand the cause of low level HBM failures seen on 65 nm CMOS products. The anomaly, which consists of a current spike occurring just prior to the actual HBM pulse, was found to be caused by contact misalignment in the tester??s discharge relay.
Unexpected functional failures were found in the core of an IC, processed in a 65 nm technology with 1.8 nm gate oxide after MM testing, although a comprehensive rail-based protection scheme was applied. Failure analysis was performed including Obirch, backside de-processing, and SEM analysis to locate the failure in the gate oxide of several core NMOS transistors. Careful TLP measurements on NMOSTs...
A new dual-base triggered SCR is presented. By adjusting the device sizings in the trigger circuit, the designer sets the trigger voltage to an application appropriate-value. The turn on time is comparable to that of DTSCRs fabricated in the same technology node, but the leakage is orders of magnitude lower.
S-parameter test structures from a 45 nm SOI CMOS technology show total capacitance per perimeter of poly-bounded ESD diodes ranges from ~0.35-0.42 fF/mum, and silicide-block (SBLK) bounded diodes show ~15-20% capacitance reduction. Floating-body or notched-silicon tied-body Gate-Silicided GGNMOS devices show total capacitance per width of ~0.65 fF/um for thin oxide devices, and ~0.72 fF/mum for thick...
A novel ESD protection implementation based on LIGBT component is presented for 0.35 mum Smart Power HV devices on SOI substrate. A Single Stage LIGBT was designed, characterized and simulated. SOA boundaries are investigated in TLP regime. ESD performances improvements achieved using LIGBT devices are highlighted and a comparison with NDRIFTMOS-based active clamps is presented.
The IEC 61000-4-2 is a standard that specifies ESD requirements for systems, not for ICs. The system level ESD standard differs fundamentally and significantly from the component level tests. Traditionally protections against system level ESD were added on the PC as discrete devices. In recent years semiconductor manufacturers are confronted more and more by requests from customers to specify IC ESD...
CDM is recognized as the main ESD threat in today’s electronics manufacturing environment. Unfortunately CDM is increasingly seen as immature. There are competing standards: JEDEC and ESDA versions of Field Induced CDM (F-CDM), JEITA’s direct charging CDM and even use of the Socketed Device Model, each producing different failure thresholds. F-CDM, the most widely accepted, has numerous technical...
Class 0 devices require proactive tool designs for ESD control. What are the design and control techniques required for high-yield handling and manufacturing of ALL types of highly ESD sensitive devices? How can you make sure your Class 0 device is safe? What safety margin can you afford to design into your process and tools? We will discuss considerations regarding product protection including, but...
The sensitivity to ESD events of electrostatically driven ohmic RF-MEMS switches under actuated and not-actuated conditions is here investigated. We have found that stiction and charge-trapping phenomena can be induced by EOS/ESD events. Preliminary results on HBM robustness with a good correlation with TLP tests are also reported. Electro-mechanical simulations have been carried out to study how...
An ESD protection solution for high voltage input pins consists of a snapback ESD device controlled by a driver circuit that is optimized for performance, small footprint and specific compatibility features. Several control circuits geared towards area minimization are presented, followed by experimental validation of the circuits.
The latest standards that define requirements for an effective ESD Control Program only make reference to point-to-point resistance measurements for qualifying garments that may be specified within such a program. Studies are reported that show that the surface voltage generated when rubbing fabrics does not relate to measured resistance.
We are reporting that a large amount of static charges are formed in the process during which the polarizing plates are attached to the LCD panel and these charges can affect the orientation of liquid crystals entailing an unintentional image on the display, which is highly undesirable in the LCD manufacturing process. To prevent this problem, polarizing films with conducting polymer layer were explored...
Device testing using an IEC-compliant hand-held 150 pF/330 Omega discharge gun was compared to a 50 Omega IEC waveform pulser. Current waveforms were recorded and components tested with both pulsers. To understand effects of different pulse source impedances, the 50 Omega pulser was modified to operate at 100 and 330 Omega delivery impedances.
Charged Plate Monitors (CPM) are commonly used to calibrate and monitor ionizer performance. When the CPM was developed, it did an excellent job of characterizing ionizer performance for an ionizer used in a 150 mm wafer fab as well as many other applications, including DC applications. Today, there are a number of ionizers operating at higher frequencies, including pulsed AC and piezoelectric ionizers...
A new approach analyzes the manufacturing critical path, defining locations of charge generation and discharge, and types of device ESD failure mechanisms experienced in the process. The technique identifies the device sensitivities a process is capable of handling in relation to HBM, CDM, field induction and machine model failure thresholds.
Several worldwide organizations create standards for controlling static charge in the semiconductor industry. The ESD Association focuses on device testing, evaluation of static control methods, and static control program development. SEMI and the International Technology Roadmap for Semiconductors (ITRS) create standards and specify acceptable levels of static charge in semiconductor manufacturing.
One of the major requirements for safe handling of IC??s is the grounding of personnel. The paper presents data about the effectiveness of using the floor/footwear system as primary means of grounding personnel in standing and sitting operation. It also discusses whether there is a contradiction with International Standards like IEC 61340-5-1 or ANSI/ESD S20.20.
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