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In this paper, methods for high resolution analysis of the intermetallics formed in the interfaces of microelectronic packaging interconnects are discussed. The application of Transmission Electron Microscopy (TEM) in combination with energy dispersive x-ray analysis and electron diffraction for a definite identification of intermetallic compounds is compared to new approaches based on Electron Backscatter...
The paper demonstrates that new failure modes can be analyzed and understood if an improved comprehensive flow in diagnostics involving non-destructive failure localization, ion-beam-supported target preparation, high-resolution electron microscopy and ultra-sensitive surface analytics are implemented in the physical failure analysis chain. For illustration, the potential of combining new non-destructive...
The paper describes the strategies of characterizing the creep behaviour of SnAg-and SnAgCu-solders through experiments on bulk specimens and on very tiny solder joints. The characteristic behaviour of these different volumes will be explained and rationalized by metallurgical considerations about the specifics of solidification in very small volumes.
The development of lead-free solder materials with improved reliability properties requires a detailed understanding of the relationship between mechanical properties and microstructure. The paper presents methods that can be applied to characterize creep and plastic deformation behaviour and shows how currently available analytical methods for microstructure investigations can be used to track the...
The paper focuses on electron microscopy investigations of board assembly for a new XFLGA package with emphasis on microstructure, intermetallic compound (IMC) and defect formation in solder to package and board metallization interfaces. XFLGA packages with NiAu lead finish were assembled using a commercial SnAg3.5Cu0.7 solder to NiAu- or CuOSP board metallization. The interface microstructure was...
Although there seems to be agreement that the SnAgCu-solder is the lead-free alloy of choice, the basic eutectic SnAgCu system does not fully satisfy the requirements of an alternative to the classic SnPb system. Therefore the question is, how the simple SnAgCu eutectic needs to be changed in order to achieve a higher mechanical performance of the solder. Changes include the increase or reduction...
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