The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Nanomanipulation under scanning electron microscopy (SEM) has been demonstrated as an enabling technique for the manipulation and characterization of nanomate-rials. We recently developed nanomanipulation techniques for the extraction and identification of DNA contained within sub-nuclear locations of a single cell nucleus. In nanomanipulation of DNA, a key step is target identification through SEM-fluorescence...
The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes...
Soldering with lead-free tin-based solder alloys demands substantially higher processing temperatures compared to conventional tin-lead solders, resulting in both significantly greater growth rates of Intermetallic Compounds (IMCs) and dissolution of surface finish layers. In this paper, the interfacial reactions between a new lead-free solder composition, eutectic Sn-0.7Cu- 0.4Co, and Electroless...
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
In this paper, we select electrospinning technique to fabricate polysulfonamide nanofibers. Polysulfonamide with relatively high inherent viscosity was prepared based on 4,4'-diaminodiphenylsulfone and terephthaloyl chloride in the common solvent N,N-Dimethylacetamide (DMAc) by the method of low-temperature solution condensation polymerization. Our research work focused on studying the effect of concentration...
This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed consumable-electrode direct current arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between...
Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxidation of the nanopowders was measured by X-ray diffraction (XRD) and other relative methods to compare the protection of the nanopowders during their preparation. Moreover, the scanning...
Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
Microstructural features and tensile properties of Sn-3.0Ag-0.5Cu solder joints on copper with various aging time at 150degC were examined. The solder inner and solder/Cu interface were analyzed by SEM to identify the fracture location, morphology and compositions. The study has showed, the tensile fracture strength of the solder joints decreases with the increased aging time, and the crack initiates...
The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was...
Continued miniaturization, increased performance, as well as increased reliability of microelectronics require development of new design and manufacturing methods. Embedding discrete passive components into the substrate has been identified as a solution capable of accommodating a portion of the future demands on microelectronics. As embedded passive components are fundamentally different from discrete...
Today's technology is tuned towards faster, smaller and better efficiency. This trend has resulted in tremendous heat being generated in microelectronics components and if not properly managed, it can result in failure of microelectronics components. A critical issue is the removal of this heat generated. We report here a new type of nano thermal interface material (Nano-TIM) using the electrospinning...
Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal...
The adhesion of copper/liquid-crystalline polymer bilayer lamination structures with various thickness fabricated with chemical electroless copper deposition (CECD) and surfaced activated bonding (SAB) were characterized mechanical shear-off tests. The influence on the surface morphology and chemical state during different processes, including sulfuric acid bath, heat treatments, plasma treatments...
Nanoparticles of Sn-4.0Ag-0.5Cu and Sn-0.4Co-0.7Cu (wt% composition) lead free solder alloys were manufactured and characterized for potential applications in microelectronics packaging. Scanning electron microscopy (SEM) analysis was carried out in order to study the morphology and size distribution of the nanoparticles. It was observed that nanoparticles of lead free alloys were almost spherical...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.