Serwis Infona wykorzystuje pliki cookies (ciasteczka). Są to wartości tekstowe, zapamiętywane przez przeglądarkę na urządzeniu użytkownika. Nasz serwis ma dostęp do tych wartości oraz wykorzystuje je do zapamiętania danych dotyczących użytkownika, takich jak np. ustawienia (typu widok ekranu, wybór języka interfejsu), zapamiętanie zalogowania. Korzystanie z serwisu Infona oznacza zgodę na zapis informacji i ich wykorzystanie dla celów korzytania z serwisu. Więcej informacji można znaleźć w Polityce prywatności oraz Regulaminie serwisu. Zamknięcie tego okienka potwierdza zapoznanie się z informacją o plikach cookies, akceptację polityki prywatności i regulaminu oraz sposobu wykorzystywania plików cookies w serwisie. Możesz zmienić ustawienia obsługi cookies w swojej przeglądarce.
A critical issue with the SiC UMOSFET is the need to develop a shielding structure for the gate oxide at the trench bottom without any increase in the JFET resistance. This study describes our new UMOSFET named IE-UMOSFET, which we developed to cope with this trade-off. A simulation showed that a low on-resistance is accompanied by an extremely low gate oxide field even with a negative gate voltage...
We developed optical interconnect technologies, i.e., an optical mid-plane, high-density connector, and a compact transceiver for future servers that enable high-bandwidth and dense integration. Using these technologies, 1500 optical connections and 37.5 Tb/s of bandwidth were built in a blade-server form factor.
Internal and external quantum efficiency and injection efficiency of nitride-based UV/DUV devices were investigated. Non radiative component in the photoluminescence and electroluminescence is found to be strongly correlated with the dislocation density.
Trench lateral power MOSFETs (TLPMs) are suitable for one chip power ICs due to its low specific on- resistance and ease of fabrication with CDMOS devices. In our smart power IC process we integrated both the high side n- channel and bidirectional TLPMs in one chip. In addition, better device characteristics of both devices were obtained with the process integration technology. The high side MOSFET...
The ultraviolet (UV) laser diode (LD) is attracting much attention for various novel applications such as in medical engineering, sterilization and high density optical storage. Group III nitrides are one of the most promising candidates to realize UV LD. The external quantum efficiency of group-Ill nitride-based light-emitting diodes (LEDs) with emission wavelength shorter than 360 nm is still far...
A low specific on-resistance bi-directional trench lateral power MOSFET (BTLPM) has been integrated with a controller in a 0.6mum BiCDMOS process for single-cell lithium-ion battery protector, downsizing the footprint of the protector in chip-scale package to 3mm 2, one-third of its multi-chip counterparts. The first-silicon results of the BTLPM switches demonstrated a breakdown voltage of 22V, a...
We have demonstrated a UV-laser diode with a lasing wavelength of 350.9 nm, which was grown on low-dislocation-density AlGaN template. The lasing operation under pulsed injection was achieved with the threshold current of about 200 mA.
We developed a 15-wavelength PLC-MZI multiplexer for Raman amplifiers. It doesn't contain either epoxy and adhesive in the optical path, so it shows good stability of high input power more than 1W.
Podaj zakres dat dla filtrowania wyświetlonych wyników. Możesz podać datę początkową, końcową lub obie daty. Daty możesz wpisać ręcznie lub wybrać za pomocą kalendarza.