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Processing of bump-less or embedded microbumps is introduced in this paper as an approach which enables scaling microbumps for below 10um pitches. Landing wafer is standard damascene process and in top wafer bumps are embedded in a soft backed polymer. Later during thermo-compression bonding this polymer is cured to bond two chips together. Process flow and results of TC bonding is discussed in this...
Cloth-like electronic devices are of great interest for the rapid development of wearable electronics. Herein we report a flexible and high-performance supercapacitor constructed on conductive cloth. In order to improve the electrochemical capacity, nickel nanocone arrays were electrodeposited onto a piece of conductive cloth (nickel plated polyester plain cloth) for the nickel current collector (NCC)...
In this paper a bump-less process is introduced in order to further scale down the pitch of microbumps. Electrical resistance measurement, Cross section SEM and mechanical characterizations show successful 3D stacking using proposed method.
Stem cell growth and migration on nanofibrous scaffolds and micro-fluidic channels on Silicon-Chip were studied by using neural stem cells isolated from adult rats' brain. Electrospinning and lithographic technique were used for developing nanofibrous-polylactic acid (PLA) and polyurethane (PU) based-scaffolds and micro-fluidic channels on Si-Chips respectively. Immunocytochemical and morphological...
An urgent need for improved thermal management of microelectronic systems has emerged as a direct consequence of increasing integration densities, both at chip and packaging level. Current thermal interface materials have been identified as a major bottleneck, hindering reduction of junction to ambient thermal resistance to future required levels (< 0.2 KW-1). In this paper we introduce and characterize...
Continued miniaturization in combination with increased performance of microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability of systems and devices. Development of advanced thermal interface materials has been identified as crucial, absorbing a portion of the advancements necessary within packaging technology. In this paper we introduce...
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