Search results for: Ker-Chang Hsieh
Journal of Alloys and Compounds > 2017 > 729 > C > 257-265
Thin Solid Films > 2014 > 562 > C > 398-404
Gold Bulletin > 2014 > 47 > 3 > 167-175
Gold Bulletin > 2014 > 47 > 4 > 237-243
Journal of Materials Science: Materials in Electronics > 2014 > 25 > 1 > 317-322
Journal of Phase Equilibria and Diffusion > 2014 > 35 > 2 > 157-162
Microelectronics Reliability > 2011 > 51 > 1 > 119-124
Thin Solid Films > 2010 > 519 > 4 > 1380-1386
Microelectronics Reliability > 2010 > 50 > 8 > 1146-1151
Journal of Electronic Materials > 2010 > 39 > 8 > 1315-1318
Thin Solid Films > 2010 > 518 > 6 > 1667-1674
Journal of Alloys and Compounds > 2009 > 483 > 1-2 > 209-212
Materials Chemistry and Physics > 2008 > 112 > 1 > 94-103
Acta Materialia > 2008 > 56 > 9 > 2032-2036
Journal of Alloys and Compounds > 2007 > 428 > 1-2 > 179-184
Journal of Electronic Materials > 2007 > 36 > 11 > 1448-1454
Intermetallics > 2006 > 14 > 8-9 > 1011-1013