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Recently, Cu wire is the most economic and major material on package wire bonding. The key factor of affecting aging test performance is IMC, which Cu wire reacts with Al pad. Because of various and advanced device development, the IMC of different Cu wire type and Al pad thickness are both important topics.
The iNEMI Cu Wire Reliability Project Team has performed reliability tests on a copper wire bonded QFN (Quad Flat No-Lead) package to assess its long term reliability. Bare copper (Cu) and Palladium coated Cu (Pd/Cu) bonding wires were used with a low chlorine mold compound as test vehicles using 5 DOE legs comparing wire type and process conditions. Five HAST (Highly Accelerated Stress Test) conditions...