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The present article investigated the performance and corrosion behavior between Ag alloy wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chlorine and low chlorine, respectively, with 18.3 and 4.1 ppm chlorine contents. The ball bonds were stressed under 130°C/85%RH with biased voltage of 10V...
Recently, Cu wire is the most economic and major material on package wire bonding. The key factor of affecting aging test performance is IMC, which Cu wire reacts with Al pad. Because of various and advanced device development, the IMC of different Cu wire type and Al pad thickness are both important topics.
In this paper, a lead frame package with trace routing capability is proposed for advanced QFN package that has copper traces to connect with pads or dies, called routable aQFN package. Four packages were conducted to evaluate the trace routing capability. The first is wire bond type 11 mm ×11 mm 141 I/Os package with trace fan-out designs. The second is wire bond type 3.2 mm × 3.2 mm 48 I/Os package...
Package-on-package has become the mainstream solution for the high bandwidth package which is used between application processor and memory of a smartphone. In order to get bandwidth increased, one way is to increase the number of data I/O, consequently the size and pitch of interconnects have to be reduced. Therefore, an improvement of current PoP structure to increase the number of interconnects...
Cu wire bonding has matured much over the years with improvements made not only to the Cu bonding process and optimization methodologies from bonder manufacturers, but also on capillaries and Cu wire itself. It is also part of the roadmap of many assembly houses to include ultra-fine-pitch(UFP) Cu wire applications. In this paper, various Cu wire types including coated Cu going down to as fine as...
The present article investigated the performance and interfacial behavior between Cu wire bond and Al pad under molding compounds of different chlorine contents. The epoxy molding compounds (EMCs) were categorized as ultra-high chlorine, high chlorine and low chlorine, respectively, with 24, 7.6, and 4.3 ppm chlorine contents. The ball bonds were stressed under 130°C/85%RH with biased voltage of 10V...
As the adoption of Cu bond wires continues, increasing quantity of component families are being qualified by component suppliers using standard acceleration test methods and durations. While these tests provide a benchmark comparison with conventional technologies such as Au wire bonding, for users of these components for high-reliability applications, a frequent discussion on reliability assessment...
Over the course of the last five years, fine pitch Cu wire bonding has gained a very large market share in the wire bond packaging market driven primarily by very high Au commodity prices. Virtually all IDMs and OSATs do offer Cu wire bond products. In ASE the penetration rate is reaching 60% or more than 9.5 billion units in shipment to date. The reliability has reached levels which equate to more...
The transitions to copper (Cu) from gold (Au) bond wires is occurring for an increasingly broader range of semiconductor components. For ball grid array (BGA) packages, key packaging materials including molding compound and substrate all need to be re-evaluated as they may interact with Cu wire bond differently from Au wires and introduce new failure mechanisms. In this work, we investigate the impact...
Wire bonding has been the predominant interconnect technology for more than 40 years and even today is holding a market share of more than 85%. The standard wire material has been gold albeit copper and aluminum wires have been used for 20 or so years in power applications. In the past few years, economics, i.e. the explosive increase in gold commodity pricing, have lead to a rapid conversion of fine...
The rapid ramping of fine pitch copper wire bonding production is a perfect example of a market driven technology implementation. The explosive increase in gold commodity pricing has paved the road for this conversion. Several challenges known from thick copper wire bonding had to be overcome to make this technology viable technically and economically. Some fundamental studies of copper wire bonding...
Copper (Cu) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for these components are expanding from consumer to high-reliability electronic systems. To assess the impact of this conversion on the overall component reliability, extended reliability testing beyond the typical JEDEC component qualification testing is needed. Additionally,...
The package on package (POP) stacking is getting more and more popular for system in package (SIP) applications. But during the assembly process, the POP had encountered the challenge of packages stacking yield loss, especially when top package and bottom package stacking. The key factors are the mount height of top package, the mold cap of bottom package, and the metallized ball land on the top surface...
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