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Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12”/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size of...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
Microelectronic components are introduced to an increasing number of applications as part of a controlling or monitoring device, as sensors or as means to tracking. Depending on the application, extreme loading profiles may need to be endured such as high temperatures, random vibrations or humid and even wet environments. Absorbed moisture has a plasticizing effect on the physical properties of polymers...
Organic dielectric materials will absorb moisture when in direct contact with a liquid or a humid environment. The dielectric then becomes a two-phase dielectric composite with new dielectric characteristics. Using the Lichtenecker Equation, the composite dielectric permittivity and loss characteristics are modeled. The loss modeling includes the polymer dielectric loss characteristics, as well as...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area.
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing with potential for low cost applications. Wafer level embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the use...
In this work we present a procedure for the construction of 3D networked epoxy moulding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations. Our investigations present part of general trend to extend failure analysis, reliability assessment and the development of packaging materials from the conventional discrete usage of simulation techniques to a more...
We have identified at least five different kinds of local breakdown according to the temperature coefficient (TC) and slope of their characteristics and electroluminescence (EL) under a reverse bias. These are 1) early prebreakdown (negative TC, low slope), 2) edge breakdown (positive TC, low slope, no EL), 3) weak defect-induced breakdown (zero or weakly negative TC, moderate slope, 1550-nm defect...
This paper addresses the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins. This is an important topic within a multi-scale framework to lifetime prediction in electronic packaging. For that purpose, epoxy-resins with small systematic variations in chemical structure have been synthesised and then characterised by various thermo-mechanical testing methods...
In this paper we present a multi-test platform to evaluate the barrier properties of encapsulation materials to be used to encapsulate electronic and implantable medical devices. This test platform leverages multiple material and process evaluation on one single substrate. Both cytotoxicity and cytoproliferation tests are possible, in combination with evaluation of barrier properties and aging monitoring...
Multiwell plates in combination with optical inspection equipment are standard tools for biological and biomedical applications e.g. cell-to-cell interaction studies for cancer treatment. Microtechnology based multiwell plates have the potential to monitor physiological cellular interactions at single cell level with a high throughput e.g. for immunotherapy of cancer or targeted drug delivery, where...
In this paper the potential of molecular dynamics simulation for structure-property correlations in epoxy-resins is discussed. This is a topic relevant for a multi-scale framework to lifetime prediction in microelectronics packaging. To achieve that objective, epoxy-resins are synthesised by systematically varying their chemical structure and then characterised by various thermo-mechanical testing...
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