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This paper is devoted to the demonstration of fundamental differences between the Fourier and non-Fourier heat transfer mechanisms in nanoscale silicon structures. One-dimensional parabolic and hyperbolic heat equation is solved for a simple test structure. Then, the obtained solutions in frequency and time domains are compared.
Power consumption measurements have been done on three different laptops. The measurements were done time dependent. It was observed that there are numerous fluctuation in the power consumption. It turned on that it is not straightforward to find a correlation between the consumption patterns and the task the computers were performing.
This paper discusses the problem of determining a thermal model of an electronic system based on the spectral analysis of its step temperature response. The proposed method yields equivalent RC Cauer ladder thermal models, which consist of only a few RC stages, but produce very accurate estimates of circuit temperature. Moreover, the values of model elements have physical significance. Such a thermal...
Thermoreflectance microscopy is a well established method for the thermal imaging of (opto)electronic components and ICs. The technique combines submicron spatial resolution with excellent temperature resolution (10mK can be achieved). The dynamic thermal behavior can be studied using either a transient pulsed boxcar or frequency domain approach, the latter including homodyne and heterodyne lock-in...
This report focuses on the problem of temperature influence on one of the most basic analog circuitry subsystem- a current mirror, based on MOSFET transistors. Basic and cascode current mirrors are put to a simulation test using a SPICE model. The influence of different temperature distributions on output current precision and output resistance are investigated.
The aim of this report is to investigate the influence of changing the ambient temperature on behavior of simple and cascode current mirror. Moreover we'll investigate the influence of changing the temperature of each of the transistors separately with different temperature gradient configurations.
In the article authors focused on the research of heat dissipation problem in electronic devices. For this purpose, a series of thermovision measurements were carried out, and the object of the research was a high-power LED diode attached to a radiator. During the research, diode cooling conditions were to change as a result of changing the properties of contact to the radiator. Authors found out...
An efficiency of photovoltaic panel depends on its temperature. The general rule is the higher temperature the lower efficiency. The temperature of PV-panel is integration of few factor and one of them is ambient (air) temperature therefore the air temperature has influence on amount of produced electric energy. In order to investigate if the ambient temperature has a positive or negative effect many...
Due to technology scaling and increasing power density thermal issues in today's VLSI integrated circuits are of very high importance. Nowadays, more than a half of IC failures is caused by exceeded heating of a semiconductor structure. Therefore, it is necessary to constantly develop accurate methods capable of predicting temperature profile inside the chip structure. We propose a model to obtain...
This paper investigates the possibility of assessing the die attach quality by the spectral analysis of the recorded device time response. The conducted analyses of the measured and the simulated time constant spectra of the thermal response allowed the explanation of the anomalous electrical oscillations observed during the operation of a power converter.
This paper describes a design, based on adiabatic digital circuit approach, where the difference between an irreversible and a reversible logical use of a gate gives rise to the theoretical Landauer limit for a one bit computation.
This paper illustrates how the information obtained from dynamic thermal measurements can be used directly for the determination of certain unknown thermal data necessary for simulation purposes. Experimental heating curves of a hybrid power amplifier are processed further to compute the time constant spectra of the thermal responses and to construct their corresponding structure functions. From these...
Thermal and time delay aspects of long interconnect lines have been investigated. Two technologies, 0.35μm and 65nm, have been compared. To design a modern integrated circuit we need to focus on very long interconnects too in order to achieve the expected frequency and signal synchronization. Introducing buffers along the line helps to spread the heat production more homogenously but consumes extra...
This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit...
This paper presents the dynamic electrothermal simulation of a rectangular resistor integrated on a semiconductor substrate. Due to the temperature dependence of the electrical conductivity of the resistive sheet, self heating provokes a coupling between the electrical and thermal problem and gives rise to nonlinear phenomena. We introduce a time stepping iterative method to perform the calculations...
In this paper the current distribution within woven electroconductive textile sheets was investigated using a computer program written for the purpose of the simulations. An iterative method of solving very large resistor networks used to model textile sheets is discussed. The factors taken into account are the conductivity of the fibres, the contact resistance between the fibres, the contact angle...
This paper presents the electrothermal simulation of integrated thin film resistors. Both the thermal and electrical problem is tackled by a semi-analytical method, without the need of generating an equivalent distributed network. As the electrical conductivity is temperature dependent, self-heating of the resistor will alterate the current distribution, leading to a non-uniform power dissipation...
This paper presents an application of thermal analysis methods for the investigation of the internal structure of electronic device packages. The problem is illustrated based on the example of two silicon carbide power diodes. These diodes provided by different manufacturers have the same ratings and package type but one of the diodes exhibits oscillatory behaviour when used in a power converter....
During a period of almost 40 years already, various fixed-angle heat spreading models have been developed in the literature. These models can be used by thermal engineers as approximations for the thermal steady state resistance of a heat source on a rear-cooled substrate. In this paper an extension of these models to dynamic (time-dependent) phenomena is proposed. The heat dissipated by a square...
This paper presents a student project aimed at the development of a distributed framework for thermal simulations of electronic circuits. The architecture of the framework is well suited for e-learning or teaching through Internet. When creating the user interface, particular attention has been paid to the issues of security. Owing to the use of the latest Internet technologies, the framework allows...
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