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Solder is widely used in electronic packaging to connect die and substrate in die attach process. It is important to get a uniform solder distribution to provide good electrical conductivity, mechanical support as well as excellent thermal properties for packages, especially for power packages with high current densities. While nonuniform solder distribution would emerge when die moves and tilts in...
Quadrate Flat Package (QFP) is chosen as package mode of chip for typical Hall-effect current sensors. In this paper, taking the deformation behavior of QFD structure under the temperature loading into consideration, according to related physics laws such as Fourier heat transfer law, Stephen-Boltzmann law and Newton's law of cooling, the thermal simulation of packaging for current sensor is implemented...
This paper proposed an effective finite element modeling method for human bone, which was suitable for orthopedic biomechanics research. Proximal femur models under four different standing postures were established and the stress distribution as well as the relationship between von Mises stress and adduction angle were analyzed. It was found that tensile stress would appear around the lateral femoral...
The piezoresistive pressure sensor is one of the major applications of MEMS (Micro-Electro-Mechanical-System) devices. Nowadays, in the field of automotive electronics, silicon-based pressure sensors are playing a significant role in the control of brake, engine, tire pressure, etc. The piezoresistive based engine oil pressure sensor mentioned in this paper is applied to detect the pressure of lubricant...
Localized induction heating for wafer level packaging is discussed. This paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area and edge...
Undesired thermal residual stresses and strains always exist in GaN epitaxial film after the process of metal organic chemical vapor deposition (MOCVD) due to difference in thermal expansion coefficients between the silicon substrate and epitaxial layer. These stresses would mostly result in defects such as dislocations, surface roughness, and even cracks in epitaxial layer preventing further device...
Selective induction heating for wafer level bonding is presented. The purpose of this paper is to investigate the relationships between the geometry of solder loop and temperature distribution in induction heating. Using finite element method (FEM) and IR thermal imager, temperature distribution and variation are explored, which shows that the temperature on the solder loops is a function of the area...
Due to large mismatch in coefficients of thermal expansion between the copper via and the silicon of Through Silicon Via(TSV), significant thermal stresses will be induced at the interfaces of copper/dielectric layer (usually SiO2) and dielectric layer/silicon when TSV structure is subjected to subsequent temperature loadings, which would influence the reliability and the electrical performance of...
Multi-physics multi-scale modeling issues in various stages of the LED manufacturing, 3D-SiP, and nano interconnects have been discussed. Molecular dynamics (MD) and finite element method (FEM) have been used to study the scale effect of the material properties and the prediction of the module behaviors which are critical to LED fabrication. We propose a new concept to integrate multi-physics/multi-scale...
A multi-physics multi-scale modeling platform has been developed and it has been applied to various stages of the LED manufacturing such as MOCVD reactor design, epitaxial growth based on silicon wafer, chip design and manufacturing, module packaging and assembly, and specific lamps. Discussions are also given to the ultra-scalable reactor design, material constitutive modeling, and curvature evolution...
As thermal performance is importance for high-power LED devices, there exists a need to build a validated model to clarify the thermal transfer mechanisms in the LED chip in terms of the chip materials and structures. High-power LED was numerically investigated using the finite element method. A series of substrate materials with different thermal conductivity and thicknesses were studied. The impact...
Undesired residual stress always exists in light emitting diode (LED) after the process of metalorganic chemical vapor deposition (MOCVD) due to difference in thermal expansion coefficient of different layers, doping, and lattice mismatch. Residual stress would mostly induce defects in the process of LED chips, the packaging, accelerated testing and their applications. The influence of strain/stress...
Since the first electrocardiogram (ECG) was recorded on a piece of sensitive paper by Einthoven in 1903, medical doctors had collected much more information of patients and saved many lives. In this paper, a novel prototype of collecting physiological parameters of human body based on silicon flexible skins and the process flow of fabrication by MEMS technology have been proposed. This novel approach...
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