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In this study, we use the Cu/SnAg/Ni/Cu joint with a thickness of 7μm/8μm/2μm /5μm and 7μm/16μm/2μm /5μm. The diameter of the solder joint is about 30 μm and the UBM opening is 18 μm in diameter with 60 μm pitches. In order to measure the resistance changes, it was fabricated which constitute four probes. By using this method we can measure the resistance changes in microbump excluding the resistance...
We present a method to experimentally identify the inverse dynamics of a human arm. We drive a person's hand with a robot along smooth reaching trajectories while measuring the motion of the shoulder and elbow joints and the force required to move the hand. We fit a model that predicts the shoulder and elbow joint torques required to achieve a desired arm motion. This torque can be supplied by functional...
In this paper we present a method to stimulate multiple muscles in a human arm to perform interaction tasks, using an implanted Functional Electrical Stimulation (FES) neuroprosthesis. The unstable effect arising from interaction tasks is considered, and the arm stability is directly treated as one of the control objectives in the controller design. By exploiting the kinematic and muscular redundancy...
Three dimensional integration circuits technology has received much attention recently since the demands of functionality and performance in microelectronic packaging for electronic products are rapidly increasing. For high-performance 3D chip stacking, high density interconnections are essential. In the current types of interconnects, solder micro bumps have been widely used and thermocompression...
Glass interposer is proposed as a superior alternative to organic and silicon-based interposers for 3DIC packaging in the near future. Because glass is an excellent dielectric material and could be fabricated with large size, it provides several attractive advantages such as excellent electrical isolation, better RF performance, better feasibility with CTE and most importantly low cost solution. In...
Recently, three dimensional integration circuits technology has received much attention since the demands of functionality and performance in microelectronic packaging for electronic products are rapidly increasing. For high-performance 3D chip stacking, high density interconnections are required. In the current types of interconnects, solder micro bumps have been widely adopted. For fine pitch solder...
Recently, three dimensional integration circuits technology has received much attention because of the demands of gradually increasing functionality and performance in microelectronic packaging for different types of electronic devices. For 3D chip stacking, high density interconnections are required in high-performance electronic products. Though the bumping process used could be either electroplating...
As the demands of functionality and performance for electronic products increase, three-dimensional chip stacking with high-density I/O has received much attention. For high density interconnections packaging, solder micro bumps are adopted extensively. However, its process temperature is high during chip stacking process. High bonding temperature would be easy to lead chip damage and chip warpage...
As the demands for high density 3DIC stacking increase, a fine-pitch chip-to-chip interconnects is becoming imperative. In conventional flip-chip technology, anisotropic conductive film (ACF) has been used in place of solder and underfill for chip attachment to substrates in some applications, because it provides many advantages. Generally speaking, ACF consists of an adhesive polymer matrix with...
We present a method for controlling a neuroprosthesis for a paralyzed human arm using functional electrical stimulation (FES). The subject has surgically implanted electrodes for stimulating muscles in her shoulder and arm. Using input/output data, a model is identified that describes the mapping from muscle stimulations to the endpoint force measured at the subject's hand. To compute the muscle stimulations...
With the increased demand of functionality in electronic device, three dimensional integration circuits technology together with downscaling of interconnection pitch present an important role for the development of next generation electronics. In the current types of interconnects, solder micro bumps have received much attention due to its low cost in material and process. For fine pitch solder micro...
Due to the raising requirements of functionality and performance in consumer electronics, high density package technology including high I/O interconnections and 3D chip-stacking technology have received a great number of attentions. Solder micro bumps are widely applied in high density interconnections packaging, but its bonding temperature is still high during process. During chip stacking process,...
The development of portable and flexible liquid crystal displays (LCDs) has led to a change in the substrate panel material. In the driver integrated circuit (IC) packaging process, ultra-thin chip on plastic (UTCOP) bonding is required to impart flexibility to plastic LCDs. In his study, the performance of 50-μm-thick ultra-thin chips on transparent polyimide (PI) substrate was investigated. To study...
Humanoid robots are widely discussed in recent years. The motion planning and control of humanoid robots can be discussed based on mobility of platforms and manipulations of arms. In this paper, we propose a robotic arm which manipulation is analog to the motion of humanpsilas upper extremities. The proposed robotic arm is designed as a seven degree-of-freedom configuration. To increase the interactivity...
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