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SiC particles and epoxy resin were applied to prepare a potential high thermal conductivity underfill material. SiC particles are thermally coated with a nano layer silica by oxidation at high temperature. Then silane was used as the surface treatment of the silica coated SiC particles to improve the interaction between filler and polymer matrix. TEM and TGA measurements were used to characterize...
A novel nanocomposite photo-curable material which can act both as a photoresist and a stress redistribution layer applied on the wafer level was synthesized and studied. In the experiments, 20-nm silica fillers were modified by a silane coupling agent through a hydrolysis and condensation reaction and then incorporated into the epoxy matrix. A photo-sensitive initiator was added into the formulation...
Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12degC at ambient conditions) to reduce solvent loss during the high...
Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12degC at ambient conditions) to reduce solvent loss during the high...
This paper presents a novel method to prepare inorganic superhydrophobic silica coatings for microelectro-mechanical systems (MEMS) packaging using sol-gel processing with tetramethoxysilane and isobutyl-trimethoxysilane as precursors. Incorporation of isobutyl-trimethoxysilane into silica causes hydrophobic isobutyl groups to be present on the surface, thus generating surface hydrophobicity. The...
A novel photo-curable nanocomposite material which can act both as a photoresist and a stress redistribution layer applied on the wafer level was synthesized and studied. In the experiments, the 20nm silica fillers are modified by silane coupling agent through the hydrolysis and condensation reaction and then incorporated into the epoxy matrix. A photo-sensitive initiator is added into the formulation...
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