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Thermal dissipation phenomena have to be considered from various viewpoints of basic functions such as phonon drift, photon emission, mass transfer and potential transfer. At present, the phonon transfer and mass transfer issues are mainly simulated and analyzed, but they are not enough for the total analysis of thermal dissipation phenomena. Paul D. Franzon, North Carolina State Univ., often says...
In our previous study, we argued that stabilization of power source voltage by optimizing a chip wiring feature was essential to achieving high performance transmission for over 40 Gbps I/O on an interface circuit. This region frequency transmission approach is fairly important to solve communication bottleneck. We will examine power supply wiring for more high frequency (over 40 Gbps) which is significant...
To achieve high performance communication it is necessary to consider all the design parameters for the switching circuit, interconnection and power supply. As these parameters definitely affect each other for over 20Gbps. These must be included for their optimization. These parameters are driver on-resistance (drivability), characteristic impedance of all connection routs, dependent frequency load...
In the general GHz measurement method, characteristics of signal transmission lines have been obtained through high-speed connecters to high-speed coaxial cables. However, measured data often did not accurately reflect actual circuit performance. This study aims to show the effect of the connection methods over 10Gbps. Teflon-based micro-strip line 200mm in length was chosen for its improved transmission...
Recent communication for cloud computing strongly requires an order of magnitude wider bandwidth than current one, such as over 28Gbps in SerDes and Interiaken protocols. So the IO transmitter and receiver becomes to one of key issues. In generally, those high bandwidth IO systems consume relative high power due to relate with fCJ⁁2 by CMOS transistor and parasitic capacitances. Additional problem...
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length...
Recent communication for cloud computing strongly requires one order magnitude wider bandwidth than current one, such as over 28Gbps in SerDes and Interlaken protocols. So the technology of IO transmitter and receiver becomes to one of key issues. In generally, those high bandwidth IO systems consume relative high power due to relate with fCV^2 by CMOS transistor and parasitic capacitances. Additional...
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length...
The main contribution of this paper is to propose an FPGA implementation of template matching using DSP slices. Template matching is a technique for finding small parts of an image which match a template image. In our approach, we use a pixel rearrangement technique that is a coarse-to-fine technique. Unlike ordinary coarse-to-fine techniques, it always can find a template image in a base image if...
We propose a novel touch panel structure, sensing method, and system which composes a low-cost transparent electrically-conductive thin film with higher Rs than the ITO film by two orders of magnitude. Relatively small number of extraction electrodes is directly attached upon the thin film without any circuit pattern. The proposed panel can realize even the wall tapestry-type touch panel of larger...
In our previous studies [1], [2], good power supply wirings on a chip have provided excellent high-speed switching and tinny power swing fluctuation. In this study, we again confirmed this by higher precision re-measurements correlated with simulations. If the power integrity (PI) would be better on the circuit, the circuit would be expected that the CMOS driver makes it sure to take higher-speed...
High-speed transmission line characteristics have been analyzed from the point view of many parameter's effects in huge amount of papers. As far as maintaining geometric (dimensional) similarity of transmission line configurations, i.e., shrink or expansion of cross-sectional dimension, characteristics of transmission lines are not affected by their configurations based on electromagnetism from Maxwell's...
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