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Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
The Stud Bump Bonding (SBB) flip chip technology on Molded Interconnect Devices (MID) is a highly promising solution to the increasing demand for reliable interconnection technology at high temperatures, a miniaturized assembly and a reduction of costs and parts.
Recent years have shown the tremendous growth of electronic use in medical devices. Especially active implants and hearing aids have driven that trend to today's ultra-small devices embedded into the body. While the integrated circuits' features a ever-decreasing critical geometries and surging performance numbers, the delivery format of such advanced chips is seldom providing the engineering teams...
Chronically implantable, wireless neural interfaces require biocompatible, long term stable, and high density integration of all functional sub-components. For this, the integration and interconnection concept of the wireless neural interface was proposed and interconnection materials and methods were investigated and characterized. The module consists of an electronics IC assembled to an electrode...
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