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Automotive IC demand is expected to grow tremendously at CAGR of ∼ 7% over the next few years. In general automotive devices can be packaged into commonly used packaging solution like SOIC, SOP, QFN, except a few automotive products may require custom packaging solution. This paper discuss the QFN packaging solution for automotive IC from the perspective of package outline design, material selection,...
In recent years, copper wire has been widely proliferated into mass production. However, the hardness of copper wire requires higher ultrasonic power and bonding force, which lead to higher risk of bond pad crack, in order to avoid bond pad crack without re-engineering the bond pad, silver alloy wire is proposed as an alternative to cu wire bonding due to its softer material property. In this paper,...
In recent years, copper wire especially palladium coated copper wire interconnects has been quite widely proliferated into mass production. However, the hardness of copper wire requires higher ultrasonic power and bonding force, which lead to higher risk of bond pad crack causing electrical test failure or board level reliability failure. In order to mitigate the risk of wire bond failure, device...
Copper wire bonding is becoming popular on multi chip (MCM) device in parallel with the general industry trend of integrating more functions into single product. In order to support device to device interconnect; bond stitch on ball (BSOB) bonding method is quite generally used in the industry. However, copper wire due to its material hardness is more difficult to be manufactured into BSOB as compared...
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