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The bonding feasibility of Insulated Au-Flash PdCu (X-PdFlash) has proven to be successful in many of the previous studies shown in various papers. This has given the confidence of this collaborative project to explore into other areas of bonding applications with potential challenges on insulated Au-Flash PdCu wire. One critical potential area of study would be in Ultra-Low-Loop(ULL) application...
With the success of developing insulated wire bond recipe in the conventional wire bond process for ball grid array (BGA) and quad flat package (QFP). The development of insulated wire bond process is moving further to explore into other areas of bonding applications with potential challenges on insulated Au-Flash PdCu wire. At the same time, the characterization process was perform on the insulation...
The insulated Au-Flash PdCu wire (X-PdFLASH) study was first initiated by Freescale, Heraeus and Microbonds with the insulated technology from Microbonds since one year ago. Since then, continuous improvements in the wire processing was conducted by machine hardware modification, process parameter re-optimization to attain a more homogeneous insulation coating layer. This was confirmed by the improved...
In the recent years, insulated wire bond is getting more attention by packaging technologist as another potential option of cost saving after Cu wire bond conversion due to its flexibility in wire bond without the fear of wire short. This is especially practical for products with very complex and multitier wire bond layout which have higher wire short risk. The process also offers greater flexibility...
Insulated wire bond is getting more attention nowadays by packaging technologist as another potential option of cost saving after Cu wire bond conversion due to its flexibility in wire bond without the fear of wire short. The process offers greater flexibility in wire bond layout design which can lead to die size reduction and standardization of substrate / leadframe for cost saving. As the wire has...
One of the key advantages to replace bare Cu wire with Pd Cu wire in semiconductor packages is to reduce corrosion risk against halogen from mold compound or substrate soldermask outgasing. However, existing wire bond recipe development methodology adopted from bare Cu wire was less effective for Pd Cu due to harder Free Air Ball (FAB) with Pd Cu wire, causing Pd Cu bond failure after biasing reliability...
To ensure a reliable Cu wire bond on Al bond pad, Freescale has learnt that good IMC plays a very important role. However, unlike Au/Al IMC measurement method which has been well established, Cu/Al IMC measurement method is still relatively new in semiconductor industry. This study was aimed to establish an effective chemical solution to etch off Cu bonded ball to check IMC coverage at the entire...
The use of copper wire for wire bonding integrated circuits (ICs) has increased significantly in recent years, driven mainly by the dramatic increase in the cost of gold. The technical advantages and limitations, particularly with respect to reliability, of copper for wire bonding, compared with gold, have been widely reported. This paper describes reliability studies comparing on copper, palladium...
Nowadays, increasing of gold price and decreasing of dielectric let copper and low-k dielectric materials become a new technology and are increasingly chosen as preferred interconnect insulated material in semiconductor applications. In this paper, a C45 ultra low k wafer technology with bond-over-active bond pads, on a thermally enhanced BGA package with 31×31mm large body size is selected to study...
Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In order to incorporate Cu in the wire-bonding process, substantial data regarding aging and intermetallic formation of Cu-Al bonds is required...
In a fast growing semiconductor market, cost reduction has driven towards package miniaturization with increasing die performance. C90, C65 and C45 wafer technologies with smaller bond pad opening and bond pad pitch have emerged. The requirement of such wafer technologies leaves little or no room for minute die top delamination, as it may result in bond ripped off and electrical failure. To prevent...
As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonded ball hardness are 34% and 60% higher than that of Au, hence increases the stress on bond pad and chip...
For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch <; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
As gold price continues to move in an overall rising trend, conversion to Cu wire has been given great focus as the main effort for cost reduction. Cu is a good alternative due to 26% lower electrical resistivity than Au, hence much higher electrical conductivity. However, Cu free-air-ball and bonded ball hardness are 34% and 60% higher than that of Au, hence increases the stress on bond pad and chip...
For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch >; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
In summary, 2N wire is able to improve thermal aging performance of ultra fine pitch wire bonding to meet reliability requirement as stringent as for automotive application. However, to improve mass production friendliness, careful characterization and process optimization need to be done on several areas, namely bonding surface condition, wire bonding process, as well as wire manufacturing process.
Wall-slip plays an important role in characterising the flow behaviour of solder paste materials. The wall slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin solvent layer adjacent to the wall, which gives rise to slippage. The wall slip effect can play an...
Environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221?C and 217?C, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of eutectic Sn-Pb solder2...
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent mechanical properties as compared with that of...
A comparison study between Sn3.5Ag solder ball and conventional Sn3.8AgO.7Cu (SAC387) solder ball was conducted on 33??33 FCPBGA with SOP pad finishing. After assembly, samples were subjected to laser scanning for slanted ball inspection. Visual inspection under low power scope was done to check for wrinkled balls. Cold ball pull (CBP) was used to evaluate the solder joint strength at 4 conditions,...
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