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Effects of electro-less Ni layer as barrier/seed layers were evaluated for high reliable and low cost Cu TSVs. To electrically characterize the effectiveness of a Ni layer as barrier/seed layers for TSV application, we fabricated the trench MOS capacitor with 5µm dia. and 50µm depth TSV array. Via holes were successfully filled by Cu electro-plating by using Ni seed layer. To characterize the blocking...
3D-LSI stack containing diametrically highly-scaled through-silicon-vias (TSVs) with diameter 2µm as well as conventional 20 µm-width Cu-TSVs were carefully studied for the thermo-mechanical stress induced by Cu-TSVs via micro-X-ray diffraction using synchrotron radiation at Spring-8. It was observed that the TSV diameter has huge impact on the magnitude of resultant thermo-mechanical stress. The...
In this paper, we present an investigation of the dielectric properties of epoxy based nanocomposites filled with silica. Epoxy nanocomposites with surface modified nanoparticles were ex-situ synthesized using a special mixing device called nanomizer. The DC breakdown characterization of the samples filled with 0.2 vol.%, 0.5 vol.% and 1.0 vol.% showed an increase of the DC breakdown strength compared...
This paper presents a multi-band receiver front-end IC in 90nm CMOS technology. The receiver front-end IC is switchable between a 5GHz front-end and a 60GHz front-end. The architecture of the receiver front-end IC is a direct conversion in 5GHz band and a superheterodyne in 60GHz band. For the miniaturization, the 5GHz and 60GHz front-ends share a variable gain amplifier for adjustment of power level...
The low thermal conductivity of polymers can be improved with the incorporation of fillers with a relatively high thermal conductivity. However, the improvement which can be achieved depends not only on the filler properties but also on the interaction between the polymer matrix and fillers. In this study, a variety of polymer composites with surface modified particles were synthesized. Hexagonal...
In order to realize pulsed ESR measurements by using a Gyrotron oscillator. 154 GHz gyrotron output had been successfully sliced to intense and short millimeter wave pulses (10 ns and 20 ns) with arbitrary delay time t by using a light controlled semiconductor shutter system.
In this paper, we verified the Poggio, Miller, Chang, Harrington, Wu and Tsai - Characteristic Basis Function Method (PMCHWT-CBFM) by applying the extended version of the CBFM for analyzing the radar cross section (RCS) of the array antenna. The method can be reduced memory usage of calculation compared with those of the direct MoM.
This study introduces a highly thermoresistant temporary bonding/debonding system. Known Good Dies (KGDs) were bonded through SOG to a support wafer. The KGDs were thinned, and Cu-TSVs were formed by via-last/backside-via processes. These KGDs can be readily debonded from the wafer by excimer laser irradiation to the a-Si:H layer on the wafer.
We have developed a robot that can inspect long distances in thin sewer pipes. Inspections of sewer pipes are necessary to prevent accidents such as road caving accidents. However, thin sewer pipes cannot be easily inspected by existing methods. To solve this problem, we developed a peristaltic crawling robot that mimics earthworm locomotion. This robot comprises six units: five joint parts and a...
Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and −2.0 µm in X and Y directions.
Cloud applications and the global delivery of Ethernet services require a scalable, reliable, virtualizable and cost/energy efficient optical transport infrastructure able to support data rates beyond 100 Gb/s. The ICT STRAUSS project addresses the requirement of future optical infrastructures for Ethernet transport beyond 100 Gb/s, by combining two network switching technologies, namely Optical Packet...
High aspect ratio through-silicon vias (3 µm diameter by 50 µm depth) have been filled by standard Cu plating process on electroless deposited (ELD) Cu seed layers on conformal liners of Ru or Co. The in-field Cu overburden that was needed to achieve electrochemical fill on the ELD-Cu seed was 600 nm. This is much lower than would have been needed in a conventional scheme with a PVD-Cu seed (of ∼...
A highly dependable 3-D stacked multicore processor with TSV self-test and self-repair functions for highly area-efficient TSV repair has been proposed. The prototype 3-D stacked multicore processor with two layer structure is implemented using die-level 3-D integration and backside Cu TSV technologies. The basic functions of tier boundary scan and self-repair circuits via TSVs between each layer...
The present research work proposes a new fast fixed-point average-value learning algorithm on the compact Stiefel manifold based on a mixed retraction/lifting pair. Numerical comparisons between fixed-point algorithms based on the proposed non-associated retraction/lifting map pair and two associated retraction/lifting pairs confirm that the averaging algorithm based on a combination of mixed maps...
In this study, we proposed and demonstrated self-assembly-based via-last/backside-via 3D integration using a temporary spin-on glass (SOG) bonding technology. A hydrogenated amorphous silicon (a-Si:H) was employed as a debonding layer. Known good dies (KGDs) were precisely self-assembled right side up on an electrostatic carrier wafer by surface tension of water, and then, the KGDs were fixed by applying...
A new temporary bonding technology has been demonstrated, where both spin-on glass (SOG) and hydrogenated amorphous silicon (a-Si:H) were used as a bonding layer and as a debonding layer, respectively. Square chips were bonded to a glass wafer through the SOG layer and a-Si:H layer. The SOG bonding was capable of withstanding chip thinning and high-temperature chemical vapor deposition (CVD) processes...
We propose a new application of stochastic point-based rendering, which was recently proposed for implicit surfaces, to large-scale laser-scanned 3D point data. Specifically, we propose a scheme to apply the rendering to transparent and fused visualization of recent large and complex laser-scanned data from cultural assets. Our scheme uses 3D points that are directly acquired using a laser scanner...
A 1700 nm band ASE light source is developed for measuring organic solvents in water. By applying the source to a mid-IR spectroscopy system, low concentrations of around 0.3 % can be measured.
We report the first experimental realization of a 1.7 µm band optical fiber amplifier by using a Tm3+-Tb3+-doped fiber as an active fiber, and 1.21µm LD pumping. The maximum signal gain of 22.5 dB and a 3 dB down output signal power of −1 dBm have been achieved at the signal wavelength around 1700 nm with a launched pump power of 277 mW. The 3 dB down amplification bandwidth was 31 nm. Noise figure...
A novel all-optical feedforward automatic gain control scheme for a multicore erbium-doped fiber amplifier repeater is proposed. The basic performance of the AGC scheme is theoretically clarified and its AGC characteristics are experimentally evaluated.
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