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The ever increasing power density in high performance microelectronic devices for large business computing and telecommunication infrastructure has led to several new reliability challenges for solder interconnects. One of them is the creep collapse and bridging of ball grid array (BGA) solder joints under heatsink compressive loads. In this study, the effect of heatsinking compressive load on the...
With continuing demands on increasing die size and device density, underfills are widely used in flip-chip and ball-grid array packages for improvement of reliability. Fracture of the underfill/die interfaces is often observed, particularly at the die corners under a humid environment, raising serious reliability concerns. Moisture uptake can also increase the dielectric constant of underfill materials...
Reliability of the flip-chip plastic ball grid array (FC-PBGA) packages is highly dependent on the properties of the constituent components and the interface formed between them. The relative mechanical compliances and thermal mismatch between the silicon chip, the underfill material and the organic laminate substrate are particularly important to the design and performance the package. Strong coupling...
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