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With progress in microelectronics the component density on a device increases drastically. As a consequence the power density reaches levels that challenge device reliability. New heat dissipation strategies are needed to efficiently drain heat. Thermal Interface Materials (TIMs) are usually used to transfer heat across interfaces, for example between a device and its packaging. Vertically Aligned...
The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot...
Compared to conventional metal heat sinks, CNT-based microfins have exceptional advantage to drag heat out from electronic components due to the unique thermal and mechanical properties of the material. This paper will review the state of CNTs applied as cooling fins in microelectronic systems. The latest progresses will be presented.
Carbon nanotubes (CNTs) have drawn a lot of attention due to a combination of extraordinary properties and a wide range of potential applications. Due to the large potentials in satisfying future large scale integrated circuit requirements, much effort has been focused on the study of CNTs as on-chip interconnects. Combined with other conventional materials, CNTs are also promising alternatives for...
The present work aims to study the heat dissipation capability of microchannel coolers with the coolant made of carbon NanoTube (CNT) suspension, which has been reported to have unusually good thermal properties. In this study, silicon microchannel coolers were prepared by the technique of deep ion reactive etching (DIRE). Stable and homogeneous CNT suspension was also produced. Meanwhile, a closed-loop...
This paper provides a comprehensive review of the recent progress of research work performed to develop new thermal interface materials. The review starts by classifying existing thermal interface materials and analyzing their advantages and disadvantages. The state of the art research is then reviewed with an emphasis on those materials based on various carbon allotropes, such as graphite, carbon...
In this paper, a novel isotropic conductive adhesive containing different fillers, which shows better properties at high temperature compared with traditional ones, was developed and the properties of various fillers were investigated. Silver flakes as the main filler and secondary materials such as silver nanoparticles, carbon nanotubes (CNT) with different volume ratios are combined to form bi-modal...
In this work, silicon microchannel coolers were made using the deep ion reactive etching (DIRE) technique. Stable and homogeneous carbon nanotube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing...
An elastic string-elastic shell model is developed to study vibration behaviors of a carbon nanowire. The present model predicts that non-coaxial vibration between the C-chain and the innermost tube does not occur due to negligible bending rigidity of the C-chain. In addition, it is found that the C-chain has most significant effect on the lowest frequency associated with radial vibration mode for...
Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
As power density in electronic system is approaching a level that conventional cooling methods canpsilat handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using carbon nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is...
This paper describes a family of novel dynamically reconfigurable logic gates with double-gate carbon nanotube field-effect transistors (DG-CNTFET). The design is based on a property specific to this device: ambivalence, enabling p-type or n-type behavior depending on the back-gate voltage. Through simulations using available models, these gates are shown to operate at 4 GHz. We subsequently compare...
This paper describes a family of novel dynamically reconfigurable logic gates with double-gate carbon nanotube field-effect transistors (DG-CNTFET). The design is based on a property specific to this device: ambivalence, enabling p-type or n-type behavior depending on the back-gate voltage. Through simulations using available models, these gates and a 10-function ALU offering fine-grain reconfigurability...
The two-dimensional computational fluid dynamics (CFD) simulations have been done for a series of material parameters of coolants in this paper. The influences of thermal conductivity, density, specific heat and viscosity on cooling have been obtained in the case studies. The pressure drop between the inlet and outlet of the cooling device is dependent on coolant's density and viscosity. Consequently,...
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures based on two dimensional fin array models in this paper. The influence of micro-fin structures, fluid speeds, heating powers and effective thermal conductivity on cooling effects have been obtained in the case studies, and the 2D fin array simulation results have been compared with our previous 1D fin...
Summary form only given. One important function of microsystem packaging is to remove the heat generated by the integrated circuits (ICs). The thermal management of microsystems has now become more crucial as the power density of ICs increases dramatically. To remove the big amount of heat is a big challenge for the packaging technology. An attractive solution is to utilize new developed nanotechnologies...
This paper describes a dynamically reconfigurable 8-function logic gate (CNT-DR8F) based on a double-gate carbon nanotube field effect transistor (DG-CNTFET). The design is based on a property specific to this device: ambivalence, enabling p-type or n-type behavior depending on the back-gate voltage. Using available models, CNT-DR8F is simulated and analyzed at 20GHz operation. The authors also give...
This paper describes a dynamically reconfigurable 8-function logic gate (CNT-DR8F) based on a double-gate carbon nanotube field effect transistor (DG-CNTFET). The design is based on a property specific to this device: ambivalence, enabling p-type or n-type behavior depending on the back-gate voltage. Using available models, CNT-DR8F is proposed, simulated and analyzed at 20 GHz operation. We also...
Described is a dynamically reconfigurable 8-function logic gate with seven double-gate carbon nanotube field-effect transistors which demonstrates p-type or n-type behaviour depending on the back-gate voltage. Through simulations, the gate is shown to operate at 20 GHz and has been used to build a 1-bit pipelined full adder using physically identical reconfigurable cells
The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and...
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