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With progress in microelectronics the component density on a device increases drastically. As a consequence the power density reaches levels that challenge device reliability. New heat dissipation strategies are needed to efficiently drain heat. Thermal Interface Materials (TIMs) are usually used to transfer heat across interfaces, for example between a device and its packaging. Vertically Aligned...
In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. In most electronic assembly, thermal interface materials (TIM) help provide a path for heat dissipation but still represent a bottleneck in the total thermal resistance of the system. VA-CNTs mats are typically grown on HR silicon substrate with Al2...
In power microelectronics, the trends towards miniaturization and higher performances result in higher power densities and more heat to be dissipated. For large systems, the associated thermal architecture is becoming more and more complex and costly. In most electronic assembly, thermal interface materials (TIM) help provide a path for the heat to be transferred from the hot source to a cooler heat...
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