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Space electronic products usually should meet the mission requirements of long life and low cost. Because of insufficient failure data, it is hard to assess the reliability precisely by using traditional reliability testing and statistical method. In this paper, a method of reliability assessment based on integration of highly accelerated life testing (HALT) and accelerated degradation testing (ADT)...
SF6 insulated electric power equipment is usually equipped with adsorbents to control the humidity and contents of decomposition products, which will affects the accuracy of monitoring results obtained by analyzing the decomposition compound. In this paper, adsorption efficiency of three frequently-used molecular sieves, including 4A, 5A and KDHF-03, were comparatively studied. The adsorption kinetics...
Power module with high power density and high heat dissipation structure has been developed because of increasing requirement for high-power electric products. Power cycling test (PCT) was often adopted to assess to reliability of power module while the cyclic load was applid in power chip. This study investigates the electro-thermo-mechanical behavior of high-power module by using numerical analysis,...
The electrical-thermal co-simulation approaches, for wires-in-air and wires-in-package, are developed by the coupling between their electrical and thermal properties, using ADS (Agilent Design System) Symbolically-Defined Devices (SDD) models for multiple wire segments. Key parameters for these simulation models are then derived from experimental results. These experimentally validated (or assisted)...
Diffuse dielectric barrier discharge was first produced in 3-mm-thick air gap at atmospheric pressure using two plane parallel electrodes each covered by one specific alumina plate with a thickness of 2.3 mm. Based on the discharge photographs of 10 ns exposure time taken with an intensified CCD camera, the diffuse discharge was identified with Townsend discharge. The Townsend breakdown voltage for...
This article presents a novel method to determine the representative properties of a thermoelectric module (TEM). The method, by applying a constant current to a thermoelectric module then measuring the module's transient voltage and both sides temperatures, could rapidly determine the module's effective properties. The properties include Seebeck coefficient (S), electrical resistance (R), and thermal...
In this paper we describe measurements of electromigration failure times in the metal traces of silicon Integrated Passive Devices (IPDs) and in the redistribution layers of embedded Wafer-Level BGA (eWLB) structures, for both aluminum and copper traces, and for via connections between the two metal layers. The results of the test are used to determine the coefficients of Black's Equation, which is...
The drive for small form factor and foot print area packages is being fueled by consumer electronic applications that today constitute 50% of semiconductor revenue. Mobile phones are experiencing explosive growth both in terms of unit shipments and increased complexity at the same time. In just one decade mobile phone has transformed from a simple communication device into more complex system integrating...
In this paper the accurate and fast measurement equipment was developed and applied to study the thermal characteristics of high power LEDs. The forward-voltage based method was conducted to measure the junction temperature of high power LEDs. Conduction type method is adopted to measure the temperature sensitivity parameter (TSP) with small magnitude of error compared with the traditional method...
3D packaging has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-in-package solution. 3D packages contain multiple heat sources that produce high power density. Heat dissipation has become a critical issue. However, unlike the single-chip package, for which thermal resistance can be easily defined and measured, the presence...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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