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This work presents an efficient power delivery network design for mitigating the coupling of power supply noise in mixed-signal electronics using power transmission lines. Digital circuitry operating at high data rates generates supply noise that can interfere with sensitive RF circuitry. Currently used methods, such as split planes and ferrite beads, have limited isolation bandwidth and can pose...
Isolation of supply noise between disparate circuit blocks is crucial. When powered by the same voltage supply, the switching noise created at the supply node of the digital devices can couple into the power path of the RF circuitry and cause significant performance degradation. Electromagnetic bandgap (EBG) structures, ferrite beads, and split planes are all commonly used to mitigate this problem,...
Signal and power integrity are crucial for ensuring high performance in high speed digital systems. As the operating frequency of digital systems increases, the power and ground bounce created by simultaneous switching noise (SSN) has become a limiting factor for the performance of these devices. SSN is caused by parasitic inductance that exists in the power delivery network (PDN), and voltage fluctuations...
Signal and power integrity are crucial for ensuring high performance in high speed digital systems. As the operating frequency of digital systems increases, the power and ground bounce created by simultaneous switching noise (SSN) has become a limiting factor for the performance of these devices. SSN is caused by parasitic inductance that exists in the power delivery network (PDN), and voltage fluctuations...
Single-ended (SE) signaling is preferable than differential signaling in high-speed memory interface designs, mainly because of less power and pin-count requirements. However, SE signaling is vulnerable to simultaneous switching noise (SSN) which is a major performance limiter. SSN is a function of the inductance of power and ground planes, which are the return paths for data signal lines. In recent...
In this paper, an efficient hybrid modeling approach for power delivery network (PDN) with through-silicon vias (TSVs) for 3D systems is proposed. The proposed approach extends multi-layer finite difference method (M-FDM) to include TSVs by extracting their parasitic behavior using an integral equation based solver. Using the proposed modeling technique the power/signal integrity of PDN with TSVs/through-glass...
Return path discontinuities (RPDs) cause the coupling between signal lines and the power delivery network, resulting in power supply noise and reduced timing and voltage margins at high speed. Prior work focused at reducing the RPD effect, usually through the use of power planes and decoupling capacitors. A new approach to address this issue replaces the plane structure with power transmission lines...
With the trend toward higher operating frequencies, the simultaneous switching noise (SSN) problem is being aggravated. The required noise tolerance for testing scenarios is more demanding so that it raises the importance of control over SSN in the interface board between a device under test and an automatic test equipment. Low noise is especially important when testing mixed-signal devices, in which...
Simultaneous switching noise (SSN) is one of the major bottlenecks for successful design of high-performance systems. Especially mixed-signal designs are very sensitive to SSN due to the low voltage levels applied in analog circuits. One way of isolation is by placing the digital and analog domains far from each other. Even then, the power planes can transfer noise voltages both vertically and horizontally...
Electromagnetic bandgap (EBG) structures that provide an excellent isolation within the stopband are extremely effective in suppressing propagation of simultaneous switching noise on parallel power planes. However, a scattering parameter measurement and full-wave electromagnetic simulation for their entire structure are costly and time consuming. This letter presents a two-dimensional dispersion-diagram...
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