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This paper will focus on the fast assessment methodology of FBGA fatigue life through simulation and physics of failure (PoF) analysis under thermal cycle. The structure of fine pitch ball grid array (FBGA) that has been investigated, and been modeled by ANSYS to compare with experimental data. There are two temperature cycling will be used, one is used to verify FEA model, and the other one is used...
In this paper, thick film chip resistors with two different types of solder alloys namely SnPb and SnAgCu have been evaluated for the effects of the solder alloy elemental composition on the solder joint failures under cyclic temperature loading conditions. The creep properties of both solders have been modelled using the Garofalo equation and the creep strain energy density has been extracted and...
The thermal fatigue and mechanical fatigue are the two main failure modes for board level solder joint in SMT. The comparison investigation of thermal fatigue and mechanical fatigue behavior of solder joint are carried out by experimental method in this study. The surface mounted test PCB is used and two kinds of solder materials, including SAC305 and Sn37Pb, are considered. It is shown that lead-free...
Wafer level Chip Scale Package (WLCSP) fulfills the demand for small, light, and portable handheld electronic devices, and it is one of the most advanced packaging concepts. When the WLCSP was assembled on board level, the connection, i.e. solder joints are generally the critical and challenging issue for the whole device's reliability. In addition to the shape and material of solder joints, the material...
Pin-through-hole (PTH) connection is one of the most common types of connection between components and circuit board. Taking the printed circuit board (PCB) of the typical electronic product air conditioner as research object, thermal fatigue behavior and failure mechanism of the through-hole solder joints were investigated by accelerated aging experiments and finite element analysis (FEA). Results...
The test vehicle is the FCOB with the chip size of 4mm*4mm*0.52mm, 0.32mm pitch and an I/O array of 13*13. Different solder height and UBM height are considered. The analysis is performed by a 2-D plane strain finite element model using Ansys 10.0 software. The Sn-3.5Ag solders are examined for their reliability by accelerated thermal cycling test with temperatures ranging from -40°C to 125°C. Two...
The paper describes experimental and finite element modelling (FEM) analyses on BGA assemblies under vibration tests. The purpose is to evaluate reinforcement methods of large BGA submitted to vibrations. Two techniques are used in this test: a cord of glue around the BGA (`peel off joint'), and gluing all the ball matrix of the second level of the BGA (Underfilling). Comparison between SnPb and SAC...
This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ?? of a material point in the solder/IMC interface, is expressed in terms of orthogonal traction components in a quadratic failure criterion of a cohesive zone model. The model is then employed in a finite element analysis of a solder...
The separation of golden ball and die pad due to the poor bonding strength of 1st ball solder joint is the main failure mode in thermo-sonic ball wire bonding. In this paper, nonlinear elastic and elasto-plastic quasi-static analysis of FAB (free air ball) in ultrasonic vibration process is carried out by finite element method with ANSYS. We study the evolution way of compressive stress distributions...
In this paper, the damage fracture of solder joints in board level electronic package subjected to drop impact loadings was numerically simulated by the finite element method and the cohesive zone model. The solder-Cu pad interface was modeled by cohesive zone elements. The results show that fracture initiates at the edge of the PCB side and the damage of solder joint is affected greatly by the used...
This paper presents an investigation on field returned open and short failures related to printed circuit board (PCB), including via hole crack, prepreg crack and insufficient circuit etching. After an experimental study with cross section, time domain reflectometry (TDR), and finite element (FE) modelling, it was found that weak plating and corrosion induced via hole crack was a major root cause...
BGAs packaging offer high pin counts and lower interconnecting space, and are suitable for high density packaging. However, it is difficult to inspect individual solder joints on BGA assembly by conventional visual methods and need a complicated practice on rework. Ball impact test is a useful method to estimate the reliability of BGA solder joint. In this study, the three-dimensional explicit finite...
In this paper, an integrated testing, finite element modeling and failure analysis approach for drop test reliability of wafer level packages is developed to examine the shock performance of large array wafer level packages. For standard JEDEC drop test, it has been found that corner component group (group A) failed first for 12 times 12 array packages. This is different from previously reported failure...
Solder joint crack is a common failure mode of printed circuit board assembly (PCBA) for electronic products. In order to investigate the crack behavior of fine-pitch SMT solder joints, accelerated thermal cycling (ATC) up to 1500 cycles was performed on advanced PCBAs with low-profile thin small outline package (TSOP). The functional examination result shows that the failure rate of TSOP solder joint...
In this present work the finite element method has been used for the simulation models in order to develop tools for the early stages of product design. The objective is to develop simulation models for Flexible Printed Circuits Boards (PCBs) in a flex-rigid concept in the shape of a wrist device to evaluate its critical stress and strain when this device is submitted to thermal loading considering...
In SMT, the investigation on solder joint's failure is always very important. Thermal fatigue is the main failure form for solder joint in SMT. In this paper the failure process of solder joint in SMT was investigated by both electrical resistance measurement method and crack observation method together. The characteristics of electrical resistance value variation of lead-tin and lead-free solder...
The demand for wafer level packages (WLP) has increased significantly due to its smaller package size and lower cost. However, board level reliability of WLP is still a major concern. This study investigates the board level temperature cycle reliability of three very different wafer level package configurations. Comprehensive studies are carried out through temperature cycle test, failure analysis,...
An array of accelerated temperature cycling (ATC) finite element (FE) simulations using ANSYStrade, and drop-impact finite element simulations using LS DYNAtrade, are used to find the optimum elastic modulus and coefficient of thermal expansion (CTE) for a stacked chip scale package. For the ATC simulations, Anand's constitutive model with properties for Sn96.5Ag3.0Cu0.5 (SAC305) and tin-lead eutectic...
Flip chip solder joints made with Cu and Ni underbump metallurgy (UBM) on the chip under current stressing were studied. The effects of material and various thicknesses (5, 10, 15, and 20 mum) of UBM on reliability were investigated. The solder material used was lead-free (Sn4.0Ag0.5Cu). Time to failure of both cases (Cu and Ni UBMs) was forecasted through the physical damage occurring at the bump...
Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint...
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