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This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ?? of a material point in the solder/IMC interface, is expressed in terms of orthogonal traction components in a quadratic failure criterion of a cohesive zone model. The model is then employed in a finite element analysis of a solder...
A thorough understanding of the mechanics of lead-free solder joint in a ball grid array (BGA) assembly under expected operating conditions is essential in developing reliable life prediction models. In this respect, accurate deformation response of Sn-4Ag-0.5Cu (SAC405) solder under varying temperature cycles and straining rates is established using unified inelastic strain theory. The mechanics...
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