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Due to the vertical heterogeneity of the multilayer reservoirs, which results in a great interlayer interference, the recovery of each layer is significantly different when all layers are perforated and produced simultaneously. The layer with poor reservoir properties has a smaller recovery than that with good reservoir properties. Layer regrouping is an effective method to reduce interlayer interference...
For the increase market demand of low- Ag lead-free solder paste, a rosin-based halogen-free flux which is suitable for low-Ag lead-free solder past Sn99.0/Ag0.3/Cu0.7 has been developed. Its board-level package printing and reflow process adaptability. The printing quality of the solder joints were tested using 3D Microscopic examination method, and the gas cavity of the sold joint were evaluated...
In SMT, the investigation on solder joint's failure is always very important. Thermal fatigue is the main failure form for solder joint in SMT. In this paper the failure process of solder joint in SMT was investigated by both electrical resistance measurement method and crack observation method together. The characteristics of electrical resistance value variation of lead-tin and lead-free solder...
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