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This paper presents Integrated Circuit (IC) fault detection of a Printed Circuit Board (PCB) model using thermal image processing. The thermal image is captured and processed from the PCB model by the finite element method (FEM). The histogram features are extracted from the ICs hotspots which are used as inputs in a classifier model. The effective features are minimized by the principal component...
Direct integration of rigid silicon interposer on PCB is emerging as a viable solution to reduce the costs associated with 2.5D/3D integration of fine pitch devices. Unlike conventional 2.5D/3D integration where a thin silicon interposer with 10∶100 aspect ratio is assembled on an organic package substrate with subsequent package assembly on a PCB, rigid silicon interposer can be directly assembled...
Silicon interposer has emerged as a substrate of choice for integrating fine pitch, high density devices. Conventional packaging of 2.5D/3D devices involves multiple level of assemblies. Normally, 2.5D/3D devices are first assembled on thinned silicon interposer with aspect ratio of 10:100 followed by second level assembly on a multi-layer organic build-up substrate. In this study we introduce direct...
Given the cost per transistor is to grow below 22nm node, SOC partitioning is emerging as a viable solution compared to a monolithic solution. Ubiquitous 2.5D/3D heterogeneous integration is evolving as an eminent approach to achieve lower cost, higher bandwidth, smaller footprint and lower power. System partitioning schemes and heterogeneous integration mechanisms directly impacts performance, cost...
This paper presents a programmable many-core platform containing 64 cores routed in a hierarchical network for biomedical signal processing applications. Individual core processors are based on a RISC architecture with DSP enhancement blocks. Given the number of conditional program loops in DSP applications such as FFT, additional hardware blocks are added that operate in parallel to each core processor...
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