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The application of plastic core solder balls (PCSB) for the assembly of a silicon (Si) interposer die inside a ceramic package has been evaluated for a harsh application. Three different variants of assembly were compared. All variants survived the performed thermal shock cycling and centrifugation. Failures observed after thermal shock cycling indicated a reduced risk of crack formation for Ag-rich...
The thermal reliability of lead-free solder joints between ceramic substrates and FR4 printed circuit boards (PCBs) is a major concern when designing ceramic ball grid arrays (CBGAs), particularly for thicker or larger substrates, since their CTE is much smaller than that of PCB. In order to achieve high reliability for critical applications, polymer core solder balls (PCSBs) are a promising solution...
There is no universally accepted theoretical interpretation of the rate constant of the pseudo-second order kinetic model of adsorption. This study proposes a relationship for the rate constant of the pseudo-second order adsorption model based on the diffusion mass transfer of the adsorbate within spherical homogeneous adsorbent microspheres. This relationship provides a new interpretation of the...
A variety of packaging technologies are widely used in mobile phone applications. One of the major concerns is reduction of the assembly space, and to this end, wafer-level chip-size package (WLCSP) and package-on-package (PoP) methods have been adopted. On the other hand, as the market transitions to LTE smartphones, larger dies and packages are needed to meet the demand for higher performance and...
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