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Isotropic conductive adhesives (ICAs) based on metal-coated polymer spheres (MPS) have shown high potential for low-temperature, high-throughput assembly of a transducer array on a substrate in ultrasound imaging applications. The process of bonding and subsequently dicing a transducer stack on a flexible substrate was evaluated. The bonding material was MPS-based ICAs containing a commercial epoxy...
This paper discusses some improvements to ultrasonic synthetic imaging in solids with primary applications to nondestructive testing of materials and structures. Specifically, the study proposes new adaptive weights applied to the beamforming array that are based on the physics of the propagating waves, specifically the displacement structure of the propagating longitudinal (L) mode and shear (S)...
Interconnection technology based on anisotropic conductive film (ACF) has been selected to assemble a transducer array on a flexible substrate in ultrasound imaging applications. The process of bonding and subsequently dicing a transducer on a flexible substrate was evaluated. The results show good integrity of ACF interconnects in test samples undergoing the assembly process. The interconnects, composed...
Flip-chip interconnection technology based on anisotropic conductive film (ACF) has been selected to assemble multiple chips (i.e. ASICs — Application-Specific Integrated Circuits) on a flexible substrate in an electro-acoustic module. The chips are relatively large with a high number of I/O pins distributed over its area (on the order of 100 mm2). In this work, the processes of bonding one single...
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