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With the introduction and proliferation of Cu wire bonding, the cost of wire bonding packages is greatly reduced compared to traditional Au wire bonding. Wire bonding is still the most popular interconnect technology and the work horse of the industry. Technology development and innovation in wire bonding has provided new packaging solutions that improve performance and reduce the cost. This paper...
Cu wire bonding has taken over Au wire bonding due to its cost savings and other performance advantages such as higher mechanical strength for complex looping and better electrical performance. Currently, Cu wire bonding of 28nm node devices has been realized in high volume production [1]. To meet the challenges of device reliability for these advanced node devices, we need to understand how to achieve...
Herein, we report construction of one kind of nesting-Fibonacci-super-lattice phononic crystal, in which the super-lattice cell is a well-defined Fibonacci generation sequence. We present a comparative study on band-gap structures of acoustic waves propagating in one-dimensional, nesting Fibonacci-periodic structure and simple-periodic structure. We find that there are more band gaps in nesting Fibonacci...
With the transition from Au wire bonding to Cu wire bonding, both bare Cu wire and Pd coated Cu (PCC) wire are now commonly used. Humidity reliability is particularly challenging for Cu wire bonding. In this paper, 18 um (0.7 mil) bare Cu and PCC wire are used in the wire bonding and HAST reliability test. Various factors can influence the HAST reliability outcome. The key factors examined in this...
The reliability of copper bonding wire in plastic mold package has been associated with the intermetallic compound formation and growth in the presence of halogen element such as chloride in epoxy molding compound. Much have been studied on copper aluminide intermetallic compounds at the copper/aluminium interface such as CuAl, CuAl2 and particularly Cu9Al4 which is known to link with failure in copper...
Wire bonding using bare Cu wire and Pd coated Cu (PdCu) wire has been adopted rapidly as a mainstream packaging technology as an alternative to Au wire bonding. The interfacial characteristics of both Au and Cu wire bonds are well understood as a result of extensive research. However, the interfacial feature and its evaluation in connection with Pd coated Cu wire bonds have not been investigated in...
Due to the increasing cost of Au, the semiconductor industry has gone through a dramatic shift away from Au wire bonding to Cu wire bonding. Pd-coated Cu (PdCu) wire has become the favored wire choice over bare Cu wire for fine pitch applications. The advantages of PdCu wire include better HAST reliability results and a more stable stitch bond process window. This paper will examine the critical aspect...
In this study, the nano-scale interfacial details of ultrasonic copper ball bonding to an aluminum metallization in the as-bonded states were investigated using high resolution scanning/transmission electron microscopy with energy dispersive spectroscopy. Our results showed that ultrasonic vibration swept aluminum oxide and copper oxide in some regions of contacting surface, where an approximate 20...
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