The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With the introduction and proliferation of Cu wire bonding, the cost of wire bonding packages is greatly reduced compared to traditional Au wire bonding. Wire bonding is still the most popular interconnect technology and the work horse of the industry. Technology development and innovation in wire bonding has provided new packaging solutions that improve performance and reduce the cost. This paper...
The adsorption kinetics, energetics and growth of naphthalene thin films, from submonolayer to about 10 layers, on a Ag(111) surface at low temperature in a ultrahigh vacuum chamber are examined by using temperature programmed desorption spectroscopy. The first layer adsorption occurs with a desorption energy of 85±5kJ/mole and results in an interface dipole of 5±1D, from charge transfer of approximately...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.