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Optimal thermal design of high-power electronic components often requires use of solder-type thermal interface materials. Pure indium solder provides best combination of mechanical and thermo-mechanical properties for efficient thermal design. Two indium TIM assembly approaches were investigated: pre-attach approach and preform approach. Pre-attach refers to bonding indium to the lid cavity first,...
Lid or heat spreader in flip chip packages has become a vital component for high performance and high power IC applications. While mechanics and reliability of flip chip packages have been extensively investigated in the last decade, majority of the research was focused on the packages without lid. Hence, we still lack of fundamental understanding of the impact of lid on the package reliability. In...
Efficient heat dissipation is a major challenge for the packaging of high power microprocessors. This paper discusses a novel lid assembly process and characterization techniques that were successfully developed for a high power microprocessor in high volume production. For a high power microprocessor flip chip organic package with under fill, die warpage as a result of CTE mismatch between the silicon...
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