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The evolution of microprocessor architectures has driven semiconductor manufacturers making transition from ceramic to organic package substrate technology in order to take full advantage of the silicon advances. However, large mismatch in coefficients of thermal expansion (CTE) between silicon die and organic substrate results in significant die/package warpage that adversely impact the package's...
Optimal thermal design of high-power electronic components often requires use of solder-type thermal interface materials. Pure indium solder provides best combination of mechanical and thermo-mechanical properties for efficient thermal design. Two indium TIM assembly approaches were investigated: pre-attach approach and preform approach. Pre-attach refers to bonding indium to the lid cavity first,...
As the increase of power densities became the primary constraint for semiconductor industry to sustain the Moore's law for microprocessor evolution, multi-core architecture has been introduced in order to meet the growing demands for performance. Non-uniform power distribution, increased die-size and multiple-chip packaging present new challenges for the thermal management of modern CPUs. Further...
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