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Flexible, stress-engineered spring interconnects are a novel technology potentially enabling room temperature assembly approaches to building highly integrated and multi-chip modules (MCMs). Such interconnects are an essential solder-free technology facilitating the MCM package diagnostics and rework. Previously, we demonstrated the performance, functionality, and reliability of compliant micro-spring...
Recent advances in silicon photonics bring significant benefits to "macrochip" grids made of arrayed chips. Such configurations have global interconnects long enough to benefit from the high speed, low energy, and high bandwidth density of optics. In this paper we consider the constraints of large macrochip systems, and explore modulator drivers and photodetector receivers that match those...
This paper describes the algorithm and design tradeoffs for multiple hardware implementations of parallel high-radix scalable Montgomery multipliers. Hardware implementations of Montgomery multipliers require choosing a radix, shift direction, and whether to use Booth encoding. Presented are processing element designs exploring combinations of radices 2, 4, and 8, right vs. left shifting, and Booth...
Thirty-four undergraduates implemented a MIPS R2000 processor for an introductory CMOS VLSI design course. This included designing a microarchitecture in Verilog, developing custom PLA generation and ad-hoc random testing tools, creating a standard cell library, schematics, layout, and PCB test board. The processor was fabricated by MOSIS on an AMI 0.5-micron process, included 160,000 transistors,...
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