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A coherent OFDR model that enables to extend the dynamic range is proposed. p/2 phase shifting technique is involved in the proposed system in order to obtain complex interference signal. The obtained complex signal is processed to remove DC and mirror peaks in the frequency domain. The simulated results show the enhancement of dynamic range.
We measure the optical spectral behavior of Mach-Zehnder interferometer formed on a planar waveguide while changing the ambient humidity level and temperature. The proposed sensor has an asymmetric structure by etching the overclad of only one side of the interferometer. Then, the etched region is coated by Polyvinylpyrrolidone polymer layer. Therefore, changes in boundary condition between core and...
We propose an assembly technique with optimum condition capable of performing high density multichip integration on a silicon optical bench platform using the design of experiment. We integrated the eight chips on a platform for 4 channels arrayed optical subassembly above 2.5Gb/s/ch.
A rigid-flexible optical printed circuit board (PCB) is described in fabrication and reliability. The satisfactory reliability results of below 0.5 dB variation are presented for reflow, foldering, and thermal shock test.
A polymeric waveguide film with embedded mirrors is presented for flexible optical interconnection. The waveguide was fabricated by a ultra violet (UV)-imprint method using a metalic imprint master. The waveguide patterns of the master were directly formed on a metallic body using ultra precision machining (UPM) method, and 45deg-angled mirrors were simultaneously constructed at the waveguide pattern...
We have presented a polymer wavelength division multiplexing (WDM) filter based on multimode interference and developed a hybrid integrated optical module for 1.31/1.55-mum bidirectional operation. The active devices were integrated on a silicon optical bench platform by flip-chip bonding technique. The polymer WDM filter chip using polymethylmethacrylate (PMMA) was fabricated by the hot embossing...
An optical interconnection module directly integrated on a flexible optical/electrical hybrid printed circuit board (O/E hybrid PCB) is presented. A newly proposed polymeric optical waveguide plays roles in the optical path and in a platform as an O/E hybrid PCB integrated with various optical/electrical components. The fabricated flexible O/E hybrid PCB had sufficient optical characteristics such...
An imprint master was fabricated by ultra precision machining (UPM) for optical waveguide. And we manufactured multimode waveguides using a thermal imprint method and the UPM master. We found that the master was suitable for an optical waveguide because it had a simple process and a fine surface profile.
Our suggested VCSEL array optical subassembly (OSA) for 120 Gb/s-level parallel optical interconnect modules was composed of a 12 channel VCSEL array chip, a SiOB, two silicon spacers, and a molded microlens with accurate guide pin holes. For high speed operation above 10 Gb/s per a channel, we carefully designed transmission lines on the SiOB. The results of the transmission lines were measured as...
We fabricated straight multimode optical waveguide films to analyze quantitatively the effectiveness of the helical bending. The optical waveguide films were very flexible and the refractive index difference between the core and the clad was 1.53% at a wavelength of 0.85 mum. This paper focuses on the helical bending losses under a proper index difference. Therefore, we measured first the bending...
We have developed a low cost 1.25 Gbps WDM bidirectional module using two integrated optical subassemblies which are composed of a planar lightwave circuit (PLC) platform and a silicon optical bench (SiOB) platform. The low cost module is achieved by employing a flip-chip bonding method with passive alignment using a Fabry-Perot laser diode (FP-LD) with a monitoring waveguide-photodiode (PD) on a...
The paper suggests a new architecture for 2-dimensional (2-D) chip-to-chip optical interconnection system. To demonstrate a high-capacity and 2-D optical interconnection based on an optical printed circuit board, we designed and fabricated an optical platform which is composed of the 2-D optical transmitter/receiver modules, a 2 layered fiber- and connector-embedded printed circuit board, as a large...
To implement an optically-data-linked computer system, we proposed a chip-to-chip optical interconnection platforms based on fiber-embedded printed-circuit boards (PCBs) and fiber-optic components for assembly. The 90deg deflection of light between the optical PCB and transceiver modules were achieved using 90deg-bent fiber blocks. The connection blocks and optical transceiver modules were passively...
For bidirectional optical link at 2.5 Gb/s, we designed and fabricated a driver-receiver combined CMOS transceiver in 0.18-mum technology, an optical connector, and an optical PCB. The CMOS transceiver provides both transmitting and receiving modes of operation on a single chip, showing -3-dB bandwidths of 2.2 GHz and 2.4 GHz, and small-signal isolations of -28 dB and -40 dB between operating modes,...
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