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Thermal dissipation phenomena have to be considered from various viewpoints of basic functions such as phonon drift, photon emission, mass transfer and potential transfer. At present, the phonon transfer and mass transfer issues are mainly simulated and analyzed, but they are not enough for the total analysis of thermal dissipation phenomena. Paul D. Franzon, North Carolina State Univ., often says...
In our previous study, we argued that stabilization of power source voltage by optimizing a chip wiring feature was essential to achieving high performance transmission for over 40 Gbps I/O on an interface circuit. This region frequency transmission approach is fairly important to solve communication bottleneck. We will examine power supply wiring for more high frequency (over 40 Gbps) which is significant...
The most important element on IoT thought is communication bandwidth that is directly affected the data processing performance and communicating each other. The way for getting wider bandwidth involves three approaches which are high speed clocking, many lanes and high data compression. The first two issues relate with packaging technology[10]. The system performance balance should put together the...
To achieve high performance communication it is necessary to consider all the design parameters for the switching circuit, interconnection and power supply. As these parameters definitely affect each other for over 20Gbps. These must be included for their optimization. These parameters are driver on-resistance (drivability), characteristic impedance of all connection routs, dependent frequency load...
IoT changes greedy monster now-a-day. That seems to be uncontrollable world. Mega-data centers (DC’s) are trying to catch the monster mainly in the US. These systems included even edge center ones are in blind as like fog weather because the DC’s providers have been developed by own inside technologies. In our historically seen, the concept has been undergoing as “high-end technologies automatically...
This is well known that IoT needs intelligent search engines to manage big data processing. We have been developing such issues with novel algorithms. CAM (Contents Addressable Memory) conducts high speed searching with high power consumption which is not productive. The LUT (Look Up Table) algorithm with certain software is one type of method that is utilized to save power and commonly found in today...
In the general GHz measurement method, characteristics of signal transmission lines have been obtained through high-speed connecters to high-speed coaxial cables. However, measured data often did not accurately reflect actual circuit performance. This study aims to show the effect of the connection methods over 10Gbps. Teflon-based micro-strip line 200mm in length was chosen for its improved transmission...
Generally, voltage measurements have been based on ground as the zero level in spite of bounced state. A lot of misunderstanding might be generated without consideration of the bounced conditions [1]. Fundamental review is done by the single probing method that separate measurement for a signal and a ground in sub-GHz pulses. The result is extracted as the ground to be mirroring with signal swing...
Recent communication for cloud computing strongly requires an order of magnitude wider bandwidth than current one, such as over 28Gbps in SerDes and Interiaken protocols. So the IO transmitter and receiver becomes to one of key issues. In generally, those high bandwidth IO systems consume relative high power due to relate with fCJ⁁2 by CMOS transistor and parasitic capacitances. Additional problem...
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length...
Recent communication for cloud computing strongly requires one order magnitude wider bandwidth than current one, such as over 28Gbps in SerDes and Interlaken protocols. So the technology of IO transmitter and receiver becomes to one of key issues. In generally, those high bandwidth IO systems consume relative high power due to relate with fCV^2 by CMOS transistor and parasitic capacitances. Additional...
Power integrity (PI) has been an important technological issue in the field of electronic circuits and systems. It has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes, that can be maintained regardless of the clock frequency, even in the GHz region. A novel technology...
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length...
Power integrity (PI) has been an important technological issue in the field of electronic circuits and systems. It has been addressed in important papers using several different approaches [1][2]. The latest concept of the best PI condition is a low impedance between the power and ground lines or planes, that can be maintained regardless of the clock frequency, even in the GHz region. A novel technology...
For IO interconnection, longer wiring induces larger signal delay and the driving power consumes proportionally the length of wiring. Therefore, high speed and low power IO design is definitely important for how to shorten wiring or to reduce power even relative longer wiring. Si interposer composed multi-chip (2.5D) provides more wiring space, however length of wiring would be longer than 3D-designed...
We propose a novel touch panel structure, sensing method, and system which composes a low-cost transparent electrically-conductive thin film with higher Rs than the ITO film by two orders of magnitude. Relatively small number of extraction electrodes is directly attached upon the thin film without any circuit pattern. The proposed panel can realize even the wall tapestry-type touch panel of larger...
In our previous studies [1], [2], good power supply wirings on a chip have provided excellent high-speed switching and tinny power swing fluctuation. In this study, we again confirmed this by higher precision re-measurements correlated with simulations. If the power integrity (PI) would be better on the circuit, the circuit would be expected that the CMOS driver makes it sure to take higher-speed...
We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D and 3-D finite element method (FEM) electromagnetic field simulator. We fabricated...
We investigated the transient response characteristic of through silicon via (TSV) in a high-resistivity silicon interposer. For this investigation, signal ground (SG)-TSV-chain pairs in high-resisitivity silicon (>1000 Ω·cm) were prepared. Various pulse waves (swing: −1.8–0 V or 0–+1.8 V, pulse width: 250 ps–100 ms, duty ratio: 1/1) were applied to a SG-TSV-chain pair by using a pulse generator,...
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