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In this work we present a multiscale simulation of a solid state dye sensitized solar cell including the real morphology of the active layer. In order to include the real morphology the device domain is split into two different regions: one treated using an effective material approximation and another one using the real structure of the blend. The real morphology has been measured using electron tomography...
This paper presents the finite element modelling of a three-phase synchronous machine (3 kW-1500 rpm). In addition to analyzing the electromagnetic behaviour of the machine, various tests (no-load, short-circuit and load tests) was performed virtually using Maxwell software and validated experimentally. This work aims to parametric identification of machines and creation of a virtual laboratory of...
The generalized Prandtl-Ishlinskii model and its inverse have been recently used in different micro-positioning applications to model and to compensate for the symmetric and asymmetric hysteresis loops. The Preisach model is one the most popular hysteresis models that used to characterize hysteresis in different materials and smart actuators. The inverse Preisach model has been used to compensate...
In this paper, we investigate the properties of a complex nonmagnetic material through the reflectance, where the permittivity is described by a mechanism model in which an unknown probability measure is placed on the model parameters. Specifically, we consider whether or not this unknown probability measure can be determined from the reflectance or the derivatives of the reflectance, and we also...
We address the integration of scheduling and dynamic optimization for batch chemical processes. The processes can have complex network structures, allowing material splitting and mixing. The integrated problem is formulated as a mixed-integer dynamic optimization problem. To reduce the computational complexity, we develop a tailored and efficient decomposition method based on the framework of generalized...
The analytical solution of a plane problem for a bimaterial plane with a crack in the shape of the circular arc located near an interface is obtained. On the crack edges external load is applied. At infinity stresses and angles of rotation are given. Method of complex potentials of Kolosov — Muskhelishvili together with a superposition method is used for solving the problem. The boundary problem is...
This paper emphasis that to evaluate the complex risk about super-huge type project, we should not only think about the probability and valuable influence of risk, but also put in factors of the main body's value preference and dynamic game playing. Thus method makes the evaluation has more rational behavioral base. Firstly, this paper analyses the characteristic of the risk evaluation and game-playing...
Seismic action is the main external factor of affecting the long-term safe operation of the large-scale underground caverns. Strengthening characteristics of materials under high strain rate and damage of surrounding rock under circulating load features are considered. Dynamic constitutive model of rock mass is put forward to analyze seismic on the underground caverns. Explicit central difference...
Time dependent hereditary properties of complex materials are well described by power-laws with real order exponent. This experimental observation and analogous electrical experiments, yield a description of these properties by using fractional-order operators. In this paper, elasto-viscous and visco-elastic behaviors of fractional order hereditary materials are firstly described by using fractional...
In a previous paper several fractional derivative models for finite deformation of viscoelastic materials are proposed (Journal of Vibration and Control, vol. 20, 1033-1041, 2014). In this paper these models are applied to three types of materials to evaluate the responses subjected to impulsive forces. It is found that the constitutive equations of the models derived from the cylindrical shape of...
Some models of elastic foundations are provided by supposing that they are composed by elastic columns with kind of interactions such as contact forces. That yield a differential equation involving gradients of the displacement field. Recent models of elastic foundation are proposed introducing into the constitutive equation of the foundation soil forces depending on the relative vertical displacements...
In this paper attention is devoted on searching a proper model for characterizing the behavior of giant reeds. To aim at this, firstly, meticulous experimental tests have been performed in the Laboratory of structural materials of University of Palermo. Further, the novel aspect of this paper is that of using an advanced Euler-Bernoulli model to fit experimental data of bending tests. Such a model...
A methodology for designing energy reduction schemes of an existing MEE system is presented in this paper. These methods include a simulation model built in WinGEMS and an optimization scheme based on energy cascade utilization principles. A working MEE system at Fujian Nanping Paper co., LTD. in China was employed as a case study. The simulation results closely approach actual production data from...
Effects of AlOx interfacial layer in the W/AlOx/TaOx/TiN structures have been investigated for the first time. This RRAM device shows long endurance of 106 cycles and good retention at 85°C for a low current compliance of 100 μA. A physics based simulation is studied to understand the set and reset mechanism of RRAM. The nature of ions migration, potential profile and temperature of filament during...
NiCu is one of the widely used thin-film materials, which is now commonly used as sensor and resistor in very-large-scale-integration (VLSI) because of its high resistivity and stability. However, with the scale decreasing and the temperature increasing in service condition, the limited reliability of NiCu thin-film material has been a key issue in microelectronics and packaging industry mainly due...
Solid-state bonding refers to the bonding of solid material A and solid material B. Numerous experimental data have shown this possibility. Neither principle nor theory at the atomic level has been reported. How is solid-state bonding possible? Fundamentally, it is possible only if materials A and B can be brought within atomic distance. Over the years, we have proposed the principle: “As A atoms...
In this work we will illustrate the criteria useful to identify simple and quick operations through which “the why and the when” a scheduled maintenance can be performed in order to avoid excessive checks and controls, often difficult and expensive to run. The question that in fact arises in the preparation of preventive maintenance program is if it is possible to satisfy the reliability requirements...
This study presents an integrated approach for the simulation of hygro-thermo-vapor-deformation analysis of electronic packages by using peridynamics. This theory is suitable for such analysis because of its mathematical structure. Its governing equation is an integro-differential equation and it is valid regardless of the existence of material and geometric discontinuities in the structure. It permits...
The wafer level ball grid array (WLBGA), a silicon die-size package, offers the small form factor and highperformance packaging solution. Good board-level reliability under drop impact is achieved on account if its light weight. There is, however, a limitation on the reliability of the solder joint at board level, subject to thermal cyclic loading. This places a limit on the silicon die-size window...
Finite element analysis was used to predict the thermal cycle fatigue life of flip chip solder joints. Three different data sets of measured thermal cycle fatigue life were simulated to assess model correlation. Variables in the measured data included solder resist opening diameter, UBM diameter, joint height, solder volume, underfill material, package structure, and temperature range. Viscoplastic...
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