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This paper investigates and compares eight most frequently used edge radiation suppression methods. Optimization and improvement for each method are discussed to achieve better radiation suppression performance. In addition, many helpful design guidelines are obtained through a comprehensive comparison of these methods, to guide better EMC design for PCB. Base on this work, one can get a good guideline...
In this study, we examine a novel insight into the worst-case power noise in power integrity analysis for the core power of an ASIC. It is found that the traditional target impedance method resorting minimizing the peak impedance cannot guarantee a minimal worst-case power noise. The reason is because the worst-case power noise may not occur when the ASIC switching current is modulated at the peak...
In this paper, a BGA package having a ARM SoC chip is introduced, which has component-type embedded decoupling capacitors (decaps) for good power integrity performance of core power. To evaluate and confirm the impact of embedded decap on core PDN (power distribution network), two different packages were manufactured with and without the embedded decaps. The self impedances of system-level core PDN...
Electrical Impedance Tomography (EIT) is a noninvasive tomographic imaging modality, where cross-sectional images of conductivity and/or permittivity distribution inside of a volume are reconstructed. Electrical Impedance and Diffused Optical Reconstruction Software (EIDORS) is used in this tomographic imaging. In this paper, simulation is carried out in two different conditions and using simulated...
In this work, the authors demonstrate Core-type and IO-type on-die noise characterization to enhance CPU PDN (Power Delivery Network) performance in microprocessor. The two representative power supply noise characteristics are simulated using excitation models and an impedance modeled of the power delivery network. Then, the design metrics for the PDN are analyzed based on excitation. Behavior of...
Decoupling core power for modern processors or SOCs is a challenging task due to large power consumption. The decoupling network designed by a commonly used target impedance approach is known to be very pessimistic and very difficult to implement. In this paper, a step surge current is identified as a major source of core power noise. By considering the ramp time of the surge current, we propose a...
This paper presents an in-depth study on how the magnitude of simultaneous switching output (SSO) noise is affected by on-chip supply grid resistances. A key observation of the study is that under certain circumstances, increasing the resistance of certain parts of a supply grid can be very effective in reducing SSO noise, and the gain from SSO noise reduction can significantly outweigh the resulted...
This paper reports on modeling of simultaneous switching noise (SSN) in power distribution network (PDN) for 3D systems, where multiple IC chips are stacked and connected by through-silicon vias (TSVs). The noises generated by current switching during the transition from idle state to active state are analyzed with both on-chip and off-chip PDNs. SSN is decomposed into different frequency components...
Signal return path discontinuities, parasitic inductance and impedance mismatch within interconnects are major factors that contribute to degraded high-speed signal quality in three-dimensional (3D) integrated circuits and systems. In this paper, we apply an alternate power delivery method and a novel I/O signaling scheme to a 3D system to address these issues. Two test vehicles made of stacked PCBs...
An analog front-end circuit of analog-to-digital converter (ADC) is one of critical parts, which defines a performance of high-speed signal acquisition boards/systems. It directly influences following characteristics of system: frequency response, noise floor, transient response, over drive recovery. The analog front-end circuit for 500 MSPS 12-bit ADC has been developed, and it features best-in-class...
The IC (integrated circuit) packaging technology has evolved and transitioned from wirebond to flipchip, multi-chip package (MCP) to 3D stacking. PoP (Package on Package) enables the vertical integration of memory on the conventional package which helps to achieve higher component density on the platform. PoP technology is very important for modern electronics devices as it features more function...
In coastal areas, the properties of the soft sediment are crucial for sound propagation prediction and relevant sonar applications. The noise of intense ship traffic is a convenient acoustic source in these areas for geoacoustic characterization. This paper introduces a sequential particle filter (PF) technique that can take advantage of the continuous ship sound field to predict the soft sediment...
Noise separators have been wildly used in separating the common mode and differential mode signals in conducted EMI measurements. The high frequency performance of a single phase noise separator is improved in this paper. It is realized by a detailed calculation of the impedance characterization of the transmission line transformer. Then an impedance matching capacitance is added at the output terminal...
This paper presents in detail channel and noise characteristics from 50 kHz to roughly 500 kHz based on the field tests over underground low voltage (LV) power lines in residential and industrial areas in Korean electricity grids. We show that the channel characteristics of narrowband signals over underground LV power lines are decent while from the literature, it is known that broadband signals on...
A generalized terminal modeling technique was proposed earlier to predict conducted electromagnetic interference from a dc-dc boost converter. This paper extends the generalized terminal modeling approach to converters with the buck-type input. The technique is developed for the electromagnetic interference modeling of switched power converters in aerospace applications where the requirements on electromagnetic...
This paper proposes the design techniques of high performance current comparator which can sense a minimum change of 8 nA for 10 μA input current. The current comparator shows fast response with 0.95 ns delay for an input current difference of 0.1 μA peak-to-peak and it can work up to 500 MHz clock frequency. The use of low impedance trans-impedance stage makes it faster and the preamplifier removes...
Conductive noise from vehicle equipments which contain inverter circuits has been increased by the demand of higher switching operation of power devices in order to improve the power efficiency. On the other hand, since the vehicle equipments are required to minimize the volume, the noise filters should be built-in the housing of inverter circuits. In this case, it is necessary that the conductive...
An effective method s proposed to enhance the SI and PI of a power-bus structure PBS) in a layered medium PCB by suppressing the EMI-causing resonance mode It s implemented by a complementary split-ring-resonator as a 1-cel metamaterial-inspired geometry formed in the PBS to remove the resonance that hinders the signal transfer from one layer to another. The method is verified by the full-wave simulation...
In designing reliable power distribution networks (PDN) for power integrity (PI), it is essential to stabilize voltage supply to devices on chip. We usually employ decoupling capacitor (decap) to suppress the noise generated by the switching of devices. There have been numerous prior works on how to select/insert decaps in chip, package, or board to maintain PI, however optimal decap selection is...
We derived expressions of power and ground voltage noises for reducing common-mode voltage in a power distribution network of an LSI and found that they have the same amplitude and a phase difference approaching 180°. To confirm this, we performed an experiment using a test board with a cover-metal structure-essentially, a floating conductor in an LSI package to reduce common-mode voltage. The evaluation...
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