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In this work we present a systematic investigation of failure mechanisms for thin-film platinum heater structures and interdigitated electrodes as components of a resistive type soot particle sensor. We study stress-migration and electromigration and effects of their interaction. Lifetime determination and SEM imaging are applied for samples which have experienced different load conditions to quantitatively...
Printed circuit board (PCB) design and manufacturing has traditionally used heavy copper layers within the board as a method of dissipating heat loads from high performance, high heat-generating devices mounted on the boards. These copper layers add substantial weight, have a very high coefficient of thermal expansion (CTE) in relation to other board fabrication materials and the semiconductor devices...
The paper investigates the dielectric charging in nanostructured materials already used or potential candidate for insulating films in MEMS capacitive switches. The investigation takes into account the percolation transport through grain boundaries in polycrystalline materials as well as trough nanoparticles, such as carbon nanotubes that are introduced to control the conductivity. The impact on conductivity...
The aggressive demand that production equipment experiences when the production rates increases and less time is available for equipment maintenance activities, turns critical equipment maintenance into a challenge. It is then when improvements to existing processes, data collection (tools and techniques), and failure root cause analysis become critical for machinery support. This paper presents the...
Combining different chemometric tools we demonstrate the reliable identification of substances out of real-world terahertz-spectra. Systematic evaluation of the spectra allows for the distinction between spectral properties arising from samples geometry versus true material absorption.
The quality of static mechanical systems' integrity control process on aging oil & gas production and process plants (P&PPs) depends on the accuracy of the condition monitoring data. This is especially the case since accurate interpretation of the data could significantly aid the right decision-making at the right time in the right location. However, anomalies have been observed in the historical...
Since a laptop caught fire in 2006 at the latest, Li-ion cells were considered as more dangerous than other accumulators [1]. Recent incidents, such as the one involving a BYD e6 electric taxi [2] or the Boeing Dreamliner [3], give rise to questions concerning the safety of L#i-ion cells. This is a crucial point, since Li-ion cells are increasingly integrated in all kinds of (electric) vehicles. Therefore...
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top package. TMV® solution is being applied to reduce the warpage and achieve the fine pitch PoP and stable stacking performance. Currently, 0.4mm MIF(Memory Interface...
The influence of the absolute junction temperature Tj∗ on IGBT power module lifetime was systematically investigated by means of active power cycling tests. Both the impact on the wire bond lift-off and the chip solder degradation mechanism could be determined separately by applying the concept of separating failure modes. The test results not only prove that classical lifetime models overestimate...
When properly employed, oil mist lubrication offers many benefits to the operation of electric motors with rolling element bearings. Cooler operating temperatures, increased reliability, and decreased maintenance issues are some of the achievable advantages associated with this system. However, there are also a host of concerns associated with its use. The costs of installing and operating a mist...
A follow-up alpha emissivity study was conducted to examine the wide variability observed in previous work that was hypothesized to be due to differences in the pulse height discrimination threshold among participant's equipment. Two samples, one mixed energy and one monoenergetic, were prepared and sequentially circulated to all participants for counting. Analysis of the data demonstrates that only...
Although metal-to-metal direct contact MEMS switches are a promising alternative to solid state switches in RF communication systems, the reliability of their electrical contacts has proven to be a barrier to entry to the market. Hot switching is known to have the most damaging effect on the contacts although an understanding of all the mechanisms leading to this damage is a work-in-progress. In this...
Enhancing the reliability Ball grid array (BGA) is significant due major contribution as an interconnection in the electronic devices. Due to the compactness of the electronic devices, ball grid array (BGA) interconnection methods are utilized as passage to transmit power and signals within the electronic. However, the reliability of the BGA is very significant as it has a direct effect on the performance...
Routing attacks have been identified for single path routing in wireless ad hoc networks. The effects of routing attacks on multipath routing have not been addressed so far. In this paper, an approach have been proposed to mitigate the black hole attack using AOMDV (Ad hoc on Demand Multipath Distance Vector) routing protocol. Some improvements have been made in AOMDV protocol. These improvements...
Construction analysis, as a new evaluation method on reliability, is applied in engineering on the intrinsic reliability of electronic components' reliability evaluating. In this article, the contents and procedure of construction analysis are discussed in detailed, with the help of an example of monolithic microwave integrated circuits. This provides a new evaluation method of electronic components...
Different materials and thickness of die-attach layers can directly affect the heat dissipation of LED devices, so the influencing mechanism of interconnect materials and thickness to the thermal performances and optical durability were studied respectively. In the experiments, chip-on-board LED devices interconnected by gold-tin(Au80Sn20), solder paste and silver paste were prepared and evaluated...
With the introduction of relevant laws and regulations in many countries, the electronic industry around the global has switched into lead-free age because of the harm of lead in solder on the environment and human health,. SnAgCu based solder is the most popular lead-free solder recently. The solder joint reliability has become an increasingly problem due to the change of packaging materials and...
Considering the influence of the cost, reliability and environment issues, the lead-free material of solder connection is paid more and more attention in integrated circuit packaging field. As the substitute of traditional solder, conductive adhesive has its own advantages. In this paper, a ball grid array (BGA) is chosen to illustrate the fatigue model for the methods of strain-based and energy-based...
Aiming at the particularity of the BDAR, the method which employs the set pair analysis based on entropy and weight to rational efficiency evaluation of the BDAR had been discussed by taking certain five amphibian equipments as example. Firstly, the evaluating index system was established by analyzing the characteristic of the BDAR and the factors which affect the efficiency evaluation of the BDAR...
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