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In this paper, the main failure modes and mechanisms were investigated through some failure analysis cases, based on this, Subsequent 160°C, 170°C and180°C lifetime tests were completed. According to the method of least squares, the degradation model of high power light emitting diodes is obtained. Using the model and ALTA9 software, the extrapolated lifetime of high power light emitting diode at...
Die to die interconnection in wirebonding process these days is just common in particular to the mature packages using Gold (Au) wire as mean for interconnection. With the intense market competition to deliver a much competitive cost of the products more manufacturers, sub-contractors and even IDM (integrated device manufacturing) are now inclined with the use of Copper (Cu) wire as an alternative...
A PHM (prognostics and health management) scheme for electronic product is proposed on the basis of physics-of-failure. This method can help online reliability evaluation under real environmental condition by the identification of potential failure mechanism and failure position for devices, products and systems, so as to establish the foundation of reliability assessment for new material, new structure...
Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge in many aspects. It has been accepted that inert N2 atmosphere can improve the wettability and reliablity of solder joints. The focus of this study is to investigate the reliability of...
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
Polymer based organic photovoltaic systems, which can be mass-produced by roll-to-roll printing technology, hold the promise for a cost-effective, lightweight and mechanical flexible solar energy conversion platform. Nevertheless, challenges still remain for large-scale applications of these flexible solar cells. One of the issues of great importance is the long-time reliability of solar cell module...
POP stacking technique satisfied the demands of miniaturization, function integration and higher memory space for mobile communication products. However, the warpage of POP package during the soldering procedure will bring the unfavorable effects to quality and reliability of the products. The paper introduces the POP assembling procedure, aims to test and results analysis the effect of package warpage...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
ULSI circuits are constantly improved by continuous scaling down the character sizes. Copper connections and the ultralow-k (ULK) materials as inter-layer dielectrics (ILD) and inter-metal dielectrics (IMD) were implemented. Therefore, the chip package interaction (CPI) becomes critical due to the mechanical properties deteriorate of ULK with high porosity. The reliability of ULK layer may be affected...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
Lead-free solder alloys are more easily oxygenized and have poor wettability compared to traditional Sn-Pb solder alloys, which affects solder joints reliability. Ar is the most plentiful rare inert gas. It has been accepted that, in Ar atmosphere, the oxidation of lead-free solder joints can be prevented and the wettability of lead-free solder joints can be improved. To date, however, few systemic...
Photovoltaic modules have been operating in the outdoor environment for more than 30 years now. These modules have been exposed to a wide range of stresses including UV and visible radiation, high and low temperatures, seasonal and diurnal temperature variations, internal electric field, localized heat, moisture including rain, humidity and condensation, abrasion and other mechanical stresses. Over...
HVDC transmission systems are being employed in many projects all over the world. In particular, the demand for long-distance HVDC power transmission lines is increasing to interconnect power grids between main land and island or wind farm grid connection. With such an increasing demand, it was required to develop new insulation materials suitable for the DC cables. The extruded insulation material...
Interconnect-related problems in the advanced technology node are identified and possible solutions are proposed. A PVD process of a double-layer Ta/TaN barrier is to be replaced with a CVD process of a single-layer barrier. Cu filling process can be changed from PVD seed deposition and electroplating to dynamic PVD reflow of Cu. Manganese and its oxide are shown as a possible choice of new barrier...
Ground penetrating radar (GPR) is widely used in the field of civil engineering, as a non-intrusive technique for road and pavement monitoring. This work presents an innovative application for mobile platforms (smartphones and tablets) for real-time GPR data processing. Our work aims at providing a useful support for engineers and technicians as well, for road and pavement inspection. According to...
We investigate the influence of polymer passivation on amorphous Indium Gallium Zinc Oxide (a-IGZO) TFT reliability. We made photosensitive siloxane passivation layer on bottom-gate type a-IGZO TFTs with SiO2/Si substrate. For photosensitive materials, contact holes can be formed by UV photolithography technique without plasma etching process, leading to serious damage to the channel layer. The samples...
As device dimension shrinks less than 65nm, the propagation delay, crosstalk noises, and power dissipation due to RC (Resistance Capacitance) coupling becomes significant. Cu and LK (Low-k dielectric) material have been introduced to reduce such delays and allow higher device speed and better performance. However, since dielectric material with low-k value usually possesses large amount of porosity,...
The research activity presented in this paper deals with accelerated reliability tests on a new electronic device, which is an optocoupler designed and manufactured in Italy for aerospace application. In the paper a complete approach for the experimental evaluation of the device reliability performance is proposed. A reliability test plan was designed and implemented, considering the application of...
Aostract is ReRAM mereasmgiy being developed for applications that require higher speeds and lower voltages than flash memory. We have found TaOx to have high performance and high reliability. However one of the phenomena observed in ReRAM is that each resistance after Set and Reset varies during every cycle. To stabilize resistive switching, the key is to limit these variations in resistance. In...
In this work a SET/RESET investigation in cycling on ReRAM arrays has been performed, in order to find the most reliable SET/RESET operation conditions. The analysis will compare DC and pulsed SET/RESET operations featuring different durations and voltages on previously DC formed 1T-lR4kbits memory arrays. A thorough analysis of the ReRAM reliability joining the cell-to-cell variability analysis to...
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