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This article used ANSYS, the software of finite element analysis, to analyze the contact stress between the wheel gear and the rack the two locking devices, which called in the switch. While through adding the necessary conditions, such as restrain methods, element types, coefficient of friction, Poisson ratio, damping ratio, contact conditions etc, We are also testing the simulation meshing run of...
The reliability level of MEMS component's layered structure is low and there isn't standardized methods to test it. This paper introduces the reliability enhancement test to study the reliability issues of MEMS layered structure. By analyzing common failure modes and causes of MEMS layered structure, the thermal-cycle test is determined as the stress, based on which the test profile is designed. The...
Through-silicon via (TSV) technology has been the core of the next generation of 3D integration. Although some TSV reliability issues have been addressed in some literatures, but the sidewall scallop resulted from Bosch etch process has not been thoroughly investigated. In this paper, we focus on the effects of different sidewall scallops on the interfacial stress evolution. An axi-symmetric single...
Based on the JEDEC standard, the three-dimensional finite element model of board level VFBGA package components was established, and the reliability of low silver lead-free solder Sn0.3Ag0.7Cu under drop impact was observed. The results show that, the mechanical impact and bending of PCB caused by mechanical shock are the main reasons which induce the drop failure of solder joint in the drop impact...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
DC/DC converters are widely used in industrial, aerospace and other fields. The reliability of DC/DC converters is very important for the whole electronic system. Overheat is the key factor infecting the reliability of DC/DC converters because of the power density of the device. Three-dimensional thermal analysis modules include heat distribution analysis and thermal stress analysis at 25 °C in this...
The paper investigates the insertion force and contact reliability of N electric connector. A finite element model (FEM) of the contacts was created and simulation of the contact force was completed by ANSYS. Impact of the friction coefficient, shrink range, length of socket, and groove width on the insertion force was analyzed by changing the structural parameters. Variation curves of the insertion...
Traditional technology of experimental modal analysis bases on the known input and output signals, and utilizes integrated information of both the excitation and responses to identify the modal parameter. In most of the actual conditions, only the response data is measurable while excitations are unknown. Thus modal parameter must be extracted only from responses. In allusion to this limitation, this...
The trends towards miniaturization in the electronics industry coupled with advances in flip chip technology have increased the use of flip chip on board or direct chip attach technology in many products. This is especially true for products where re-work is not an option. Reliability issues were overcome by the use of underfill to couple the chip to the substrate and subsequently significant advances...
In this paper, thermal characteristics (Joule heating) induced by currents in short metal interconnect lines are studied. Electrical-thermal 3D-Finite Element Method (FEM) simulation is employed to model the property of temperature in short length metal lines and an empirical yet practical current model with metal line length effect is introduced. Consequently, the Irms current gain up to 25% in short...
Through-silicon via (TSV) technology has been the core of the next generation of 3D integration. Although some TSV reliability issues have been addressed in some literatures, but the sidewall scallop resulted from Bosch etch process has not been thoroughly investigated. In this paper, we focus on the effects of different sidewall scallops on the interfacial stress evolution. An axi-symmetric single...
The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS the finite element analysis of the stress and strain distribution in the model was performed under random vibration load. Comparative analysis of the stress and strain of TSV interconnect structure between the micro-bump materials are copper and SAC387. And also comparative analysis the stress and...
As an indispensible part of electronic equipment, the reliability of the whole system is affected by the degradation performance of power MOSFET tube. Based on geometry, material properties and boundary conditions, the repeated testing can be reduced, and the period of failure analysis can be shortened. This article is based on the finite element model of power MOSFET TO-263, electric thermal — mechanical...
Based on the JEDEC standard, the three-dimensional finite element model of board level VFBGA package components was established, and the reliability of low silver lead-free solder Sn0.3Ag0.7Cu under drop impact was observed. The results show that, the mechanical impact and bending of PCB caused by mechanical shock are the main reasons which induce the drop failure of solder joint in the drop impact...
For the sustainable development of our highly electrified societies, power electronics technology is playing an important role. Especially in the field of electric power systems, it is considered as one of the essential technologies which make power grids more efficient, more reliable and more environment-friendly. Those are the goals of so-called smart grids. In this paper, expected roles and applications...
Interconnect reliability of wafer level packages (WLP) is one of the major concerns because of the direct connection of die to board without any substrate interposer. The dominant failure modes due to temperature cycling and drop include cracks in bulk solder, crack at pad to IMC interface, and RDL cracking at UBM interface. A number of factors affect this reliability; such as UBM/Pad size, bump density,...
Presence of a thermal enabling load applied to Ball Grid Array (BGA) components creates a distinctive set of evaluations to be completed for reliability of solder joints (SJ) that connect the BGA to the board. This becomes especially relevant for newer technologies that drive to smaller component form factors. In this comprehensive study, a computational mechanics based Design of Experiments approach...
Replacing Silicon Dioxide (SiO2) with low-k and ultralow-k (ULK), as a dielectric, in the Back-End-Of-Line (BEoL) has allowed the trend of miniaturization and convergence to continue. Although using low-k and ULK greatly increases the device performance, being mechanically weak these dielectric materials pose a serious challenge from the reliability standpoint. Delamination along the metal-dielectric...
One of the most critical failure modes in a BGA package is the solder interconnect failure (2nd level). Conventionally, the solder damage is due to the mismatch of coefficient of thermal expansion (CTE) between the various package components and the PCB. It is absolutely critical to identify and minimize the BGA damage under thermal cycling to improve the package reliability. In the past, the critical...
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