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Two kinds of new silicon actuators, cantilever and twisted-beam, based on pn diode actuation principle are presented. The space gap that is absolutely needed in conventional electrostatic MEMS actuators is replaced by a depletion layer in reversely-biased pn diode. The strong electric field generated in the depletion layer forces a silicon microstructure to vibrate. The microstructure causes a large...
In this paper, we propose a corrugated diaphragm applied to the fiber optic pressure sensor which needs a wide sensing range and a large deflection. The corrugated diaphragm can effectively improve the sensitivity of the sensor has been proved by ANSYS simulation. The stress concentration is weakened after the silicon is chamfered into corrugated diaphragm by isotropic etching process. The sensitivity...
In this work, we present a newly titanium-contained periodic amorphous carbon(a-C) composite films by magnetron sputtering process on silicon (100) substrate which has lower intrinsic compressive stress that can be used in electrical modulation pulsed MEMS infrared(IR) source for NDIR gas sensors. The fabrication process, results, performance and results analysis are then carried out.
We conduct a systematic scaling analysis of the sensitivity of a silicon capacitive MEMS microphone based on a dimensionless 1-degree-of-freedom (1DOF) model considering residual stress. The theoretical normalized sensitivity we derived is a nonlinear function of normalized diaphragm size (h/a), acoustic driving frequency, 3 effective stiffness terms and the other parameters. From our 1DOF model,...
The emerging trend in wireless communication devices have shaped the requirement of micro-devices having the inimitable capability of operating in the radio frequency (RF) range. RF MEMS switches have brought about a revolution in the volatile area of nanotechnology, due to its exceptional and extensive switching capability. The focus of this research is the analysis and redesign of contact type radio...
In this work, a MEMS infrared source applied to compact Non-Dispersive Infrared (NDIR) gas sensor is reported. Compared to other related things, the source coats integrated nanostructure black silicon compatible with CMOS technique on the poly-silicon. Hence the emissivity is as high as 98% at 3∼5µm wave range; relat ively the radiation efficiency is increased by 40% through calculation. Suspension...
For the development of lifetime models in a physics-of-failure approach for microelectronic devices and functional elements on the submicron or even nanoscopic scale, the exact knowledge of the materials in use and their failure behavior is imperative. A piezoresistive MEMS force sensor, which can be integrated in MEMS sized tensile and fatigue test stages, was developed and is characterized using...
This paper proposes an electromagnetic induction type MEMS (Micro Electro Mechanical Systems) motor. The developed MEMS motor is combined the MEMS process and the multilayer ceramic technology. The MEMS process forms the silicon miniature components for a structural part. The multilayer ceramic technology fabricates a miniature ceramic magnetic circuit. This technology is possible to realize a miniature...
Micro electro mechanical systems (MEMS) based micro gripper for micro-assembling processes is designed. Gripper arms are actuated using a combination of Ni-Ti shape memory alloys and Si springs allowing a gripping range of 1–120µm. Heat which is needed to actuate shape memory alloy (SMA) is obtained by electro thermal properties of Ni-Ti by passing a current which is controlled by specially designed...
It is essential for the Micro Electro Mechanical Systems (MEMS) research industry to introduce novel concepts of micro motors to overcome problems in existing micro motors. This paper propose a novel concept of a micro motor using kink actuators and reciprocating rack and pinion assembly. Design details of the reciprocating rack and pinion is discussed in the paper. A detailed analysis of structural,...
This paper presents the design and simulation of a 4-bit digital MEMS varactor with high capacitance ratio. The proposed varactor design consists of four beams over a co-planar waveguide (CPW) line. A new truss beam design is proposed in order to reduce the spring constant of conventional solid beam structure which results in pull-in voltage of 24.3V making it suitable for low loss phase shifters...
An increasing number of substrates get sent through thinning. Some of those also require a polished surface. Temporary bonding is needed to support that. In order take some Si wafers down to 15u, a process flow with unique bonding, grinding, and polishing steps was used. Understanding how to improve many of the process steps was important to achieving the objective.
This work focuses on the designing of inter-digitated capacitive device using COMSOL Multiphysics. The designed capacitive device consists of inter-digitated fingers capacitors (IDT) which increases the capacitance of the device proportionally to the number of fingers. The IDT configuration can be utilized for various types of applications such as accelerometer, gyroscope etc. The designed IDT focuses...
In this paper we present the recent improvement of a silicon micro-mechanical vibrating beam accelerometer (SVBA) which combine the advantage of low cost of silicon MEMS fabrication technology, small size vacuum wafer level package, low noise low power application-specific integrated oscillation circuit and digital frequency demodulation technology. Under room temperature, it has achieved bias instability...
This paper presents an optimized design of Radio Frequency (RF) Micro-Electro-Mechanical System (MEMS) capacitive switch. The optimized design of proposed switch include utilization of three fabrication steps of lithography which helps in effectively reducing the cost of fabrication and the mechanical modeling of switch has Nano-scaled dimensions which again is beneficial in obtaining scaled device...
This paper reports a novel, low-cost and inherently simple vertical signal transmission method for glass-silicon-glass sandwich micro-electro-mechanical systems (MEMS) gyroscopes based on heavily doped silicon-bridge. As for the fabrication technique, only glass-to-silicon anodic bonding and after-laser-trimming process are needed, which are fully compatible with standard MEMS technology. Micro gyroscopes...
This paper demonstrates a silicon resonant accelerometer which consists of a MEMS structure and an ASIC readout circuit. The MEMS sensor is fabricated in an 80-µm thick SOI process with a wafer level vacuum package. For noise reduction, several techniques are employed during the circuit design. And in order to reduce the temperature drift due to self heating, the power consumption is carefully limited...
Today's packaging standard for consumer MEMS sensors are plastic mold packages of the LGA or QFN type. Multiple chips are placed on a substrate or leadframe, electrically connected by wire bonds and protected by overmolding the sensitive devices. While being a flexible and very effective packaging technology it contributes significantly to the overall sensor dimensions in x-, y- and z-direction. The...
The Radio Frequency Micro-electromechanical system (RF MEMS) has compact geometries and are very used in Monolithic Microwave Integrate Circuit (MMIC) for different important applications with respect to their size and their effectiveness. Its effectiveness can be improved by reducing the ElectroMagnetic Interference EMI problem with better Electromagnetic compatibility EMC immunity of the component...
Several kinds of micro-electro-mechanical systems are sensitive to pressure. Some need to interface to ambient condition in order to aim intended function, but others claim hermetic packages to keep the constant internal pressure over MEMS devices operation time [1][2]. This study presents the novel method to control the pressure level of different chambers fabricated using the same wafer-level-packaging...
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