The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, we explore the design considerations of two approaches to 2.5-D integration (silicon interposer and bridge-chip) from a thermal perspective and compare to 3-D ICs. Moreover, the impact of die thickness mismatch and die spacing are investigated in 2.5-D systems. We conclude that the die dissipating the largest power should be the thickest in a multi-die package. Larger lateral spacing...
In this paper, we proposed a novel stacked layer of liner structure around the TSV's and verified its performance on noise coupling between them. The performance of proposed structure with different materials and thickness were optimized and verified with respect to the noise coupling reduction. The obtained results show almost equal noise reduction performance of around 40% with the Teflon-Cu-Teflon...
In this paper, performance of noise coupling is studied using conventional SiO2 liner and Teflon AF1600 liner over different TSV structures (using only liner and liner surrounded by p+ guard ring). We have taken an optimized liner thickness of 0.15 μm and remaining metal filler as Cu for the entire simulation purpose. Our result confirms significant improvement in noise coupling using liners made...
In this paper, we introduce a new two mode division (de) multiplexer with optical properties of broad bandwidth, high mode conversion efficiency that is built on silicon-on-insulator (SOI) platform. By using an asymmetric directional coupler in the form of an MZI structure, mode (de)multiplexer from the fundamental mode TE0 and the firstorder mode TE1 can be achieved by numerically analysis. Performance...
With bias conditions changed during irradiation, the bias dependence of the total dose radiation response of fully depleted (FD) silicon-on-insulator (SOI) n-channel MOS transistors (NMOSFETs) is investigated preliminarily. It is found that the threshold voltage shift of the FD SOI NMOSFETs as a function of total dose exhibits an abrupt inverse change, namely, a unexpected rapid reduction, with increasing...
We demonstrate a very low loss coupler between a silicon nanowire waveguide and ultra-low loss (less than 2 dB/m) silicon nitride waveguide. Coupling between layers is achieved loss below 0.1 dB per transition over 50 nm of bandwidth.
We propose and demonstrate hybrid integration of a diode laser array with a passive coherent beam combining (CBC) cavity on silicon photonics platform. We show that the critical bonding alignment in the vertical direction can be precisely controlled by dry-etched pedestals on the silicon chip.
We demonstrate a mode-evolution based coupler for Ge-on-Si photodetectors achieving uniform power absorption in germanium leading to an 88% increase in photocurrent generation under 29mW illumination. We also measure a 7.4mA/cm2 dark current density at −1V, 1550nm responsivity of 1.01A/W and 40GHz 3-dB electro-optic bandwidth.
We experimentally demonstrate a silicon-on-insulator microring resonator filter that uses bent contradirectional couplers to eliminate the filter's free spectral range. The filter's measured side-mode suppression is greater than 15 dB, the extinction ratio is ∼19 dB, and the 3-dB bandwidth is ∼23 GHz.
In this paper, we propose a high-performance method to suppress global electromagnetic noise coupling in 3D through silicon via (TSV) system in package (SiP). This technique needs to form a periodic shielding structure in 3D SiP, which consists of contact arrays, grid ground planes and ground TSV array. Contact arrays and grid ground planes can suppress noise coupling in the shallow substrate and...
We fabricated and demonstrate a very compact, broadband, 30 μm long, bilayer inverse taper edge coupler for silicon photonics with enhanced coupling efficiencies for both TE and TM polarizations with 1.33 dB coupling loss from an input fiber.
We investigated the transport properties of n+-p-n+ liquid-gated Si NW FET biosensors using noise spectroscopy. We found that the gate coupling effect results in the channel position being shifted into the depth of the nanowire when the back gate voltage is applied. It was shown that the noise level and signal-to-noise ratio depends on the selected operating mode. By applying the back gate voltage,...
An inductive coupling technique for wireless interconnection of side-by-side chips within a package is presented. Data is transferred by using changes in magnetic field that occur when the current in coils on the chips is switched off. The circuit layout area and power consumption of transceivers have respectively been reduced to 1/3 and 1/6. A world-leading transmission rate of 1 Tb/s/mm2, which...
Hybrid systems combine Large-Area Electronics (LAE) with high-performance technologies (e.g., silicon CMOS) [1]. With architectural concepts for hybrid systems broadening to match the range of emerging applications, this paper examines modular approaches for multi-sheet, multi-technology integration. It identifies the interfaces required as a critical backbone. For interfaces associated with various...
This paper proposes a novel method to organise the design of a diagnostic unit that should detect faults in a decentralised controlled interconnected system. A fault at a subsystem should be detected by a local model-based diagnostic unit that only evaluates the local signals of the faulty subsystem. The focus of this paper is on the organisation of the design process of the diagnostic unit without...
We demonstrate a bandwidth and wavelength programmable silicon double microring optical filter that can be automatically, accurately, and repeatably set to an optimal Butterworth shape. The method automatically compensates for fabrication variations and thermal crosstalk.
We report a tunable silicon microring laser with 150 kHz line-width, above 29 mW output power and 60dB SMSR. Coherent optical OFDM 4-QAM and 16-QAM transmissions using this laser are also demonstrated.
A fabrication-tolerant polarization beam splitter (PBS) based on grating-assisted contradirectional couplers is experimentally demonstrated. Over 30-dB extinction ratios are achieved for both polarizations. Large fabrication tolerance in coupling length is also verified.
This paper addresses the self-interference (SI) cancellation in a full-duplex radio transceiver. In particular, we focus on shared-antenna based full-duplex transceivers where the self-interference coupling channel is always frequency-selective and can also be strongly time-varying depending on the antenna matching characteristics and reflections from the surroundings. A novel digitally-controlled...
The full-duplex (FD) based devices are capable of concurrently transmitting and receiving signals with a single frequency band. However, a severe self-interference (SI) due to the large difference between the power of the devices' own transmission and that of the signal of interest may be imposed on the FD based devices, thus significantly eroding the received signal-to-interference-plus-noise ratio...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.