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A new switching scheme for 3-phase interleaved bidirectional DC-DC converter is proposed. The proposed scheme provides soft switching condition for all the switches in both charging and discharging modes regardless of the output power level. Analysis and simulation are carried out for 3kW bidirectional DC-DC converter to charge and discharge a battery of an electric vehicle. Simulation results show...
Three dimensional IC (3D IC) has lots of through-Si vias (TSVs) and metal microbumps for electrical connection between stacked IC chips, and also has organic adhesives to enhance the mechanical strength of 3D IC. However, the coefficient of thermal expansion (CTE) mismatch between microbumps and organic adhesives generate the local bending stress in thinned IC chips. Therefore, Keep-Out-Zone (KOZ)...
Die chipping or cracking in bare-die FCBGA packages is occasionally but consistently reported by OEMs during system-level heat sink installation. Since heat sink assembly is often a manual process, it can be difficult to determine if the damage was the result of a latent component defect or was induced during heat sink assembly. Most heat sinks require some type of spring force to maintain sufficient...
We are developing an electrode array for epidural spinal cord stimulation and a thin integrated circuit (IC) is to be embedded in it. This paper focuses on the development and characterization of a manual process for thinning individual IC die and discusses the issues associated with thinning small dice by a manual process. The procedure allows easy and controlled post-separation thinning of small...
As the Moore's law is drawing to an end, there is a growing consensus that 3D stacking of Si integrated circuit chips is necessary to continue the current technological trend. In our work, a test 3D IC structure is successfully achieved and the effect of filler trap on microbump of solder joints will be discussed. In our test samples, the two Si chips are connected through thermo-compression bonding...
Due to the sharp rise in population and industrial and technological growth there has been a rapid rise in the need for fossil fuels like petrol. Hence there is a need to develop alternate fuels. One such alternate fuel can be petrol alcohol blends. These fuels will not only meet the fuel requirements of today and future but also increase the performance of IC engine and reduce emissions. In this...
To meet the critical reliability requirements of aerospace electronics, reliability design needs to be integrated into the early stage of product design process. In this paper the role of finite element analysis, thermodynamic calculation, and microstructural simulation in reliability design are introduced, followed by the discussion of failure oriented accelerated tests with emphasis on failure mechanisms...
A compact, CPW- fed rectangular slot antenna with octagon shaped tuning stub for WLAN and HIPERLAN/2 applications is presented. The antenna consists of CPW feed, rectangular slot and an octagon-shaped exciting stub. The octagon shaped stub is simple and has very few parameters, which are convenient to optimize. The proposed antenna is designed on an inexpensive FR4-epoxy substrate with dielectric...
Two ontologies are needed to be mapped in order to make them interoperable. In ontology mapping primary focus is on making the process more efficient in terms of resources consumed during the process. The complexity of matching process is usually varies in accordance with the size of the ontology under consideration. A straightforward approach is to reduce the number of pair-wise comparisons. Out...
With recent advances in parallel cooperative transmissions between multiple source-destination pairs, interference cancellation (IC) can be achieved to improve sum data rate for one group of cooperating users. However, from the perspective of network capacity, user cooperation may not be always appealing, since the increased sum data rate of cooperating users comes at the price of blocking more neighboring...
The incidence of apnea-bradycardia episodes in preterm infants may lead to neurological disorders. Prediction and detection of these episodes are an important task in healthcare systems. In this paper, a coupled hidden Markov model (CHMM) based method is applied to detect apnea-bradycardia episodes. This model is evaluated and compared with two other methods based on hidden Markov model (HMM) and...
The Physically Unclonable Function (PUF) has been presented to defend physical attacks for RFID authentication. The silicon PUF employs difference of gate and wire delays on silicon chip to protect hardware copies of RFID. Because of the process variation in IC manufacturing, each silicon chip has different delays for gates and wires and, thus, the PUF-based encryption on each chip has different output...
Thin crystalline silicon solar cells are of interest due to significant material cost reduction and potentially high conversion efficiency. We have previously demonstrated a patented, novel exfoliation technology capable of producing large area (156×156 mm) 25 µm thin flexible mono c-Si cells with high efficiencies. In this paper we address the mechanical strength and handling requirements of these...
In this paper, we present results on microcrystalline silicon solar cells that are deposited from SiF4/H2/Ar mixtures, on which efficiencies exceeding 9% have already been obtained. Structural characterizations of the cells indicate a fully crystalline material with no preferential crystallographic orientation. This suggests that, as opposed to microcrystalline silicon cells deposited using silane,...
Silicon interposer is an emerging and promising technology for 3D integration of LED systems. In this paper, the thermal performance of silicon interposer is investigated through finite element analysis (FEA). Different approaches of silicon integration are evaluated: double-side interposer and double-layer interposer. The effect of thermal interface material (TIM) on the junction temperature of LEDs...
We report on the design of a novel single photon counting X-Ray prototype camera for in-house XRD. The heart of the camera is a large area, hybrid pixel detector, which consists of the monolithic pixelated silicon sensor bump bonded to 16 readout chips called PXD18k, presented for the first time at NSS 2011. The radiation sensitive area of the camera is 38.5 mm × 77.5 mm and consists of 294,912 pixels...
A major consideration for practical integration of 3D integrated circuits is compatibility of the thermal processes used to build new transistors in the vertical dimension, with sustained viability of the devices already fabricated beneath. Major contributions to the thermal profile of IC processes are laser-based anneals, rapid-thermal anneals and deposition processes, and traditional furnace processes...
LED micro-displays offer diverse applications with their superior characteristics and unique performance, particularly in high light utilization efficiency (LUE), design simplicity (Backlight Unit (BLU)-free), long lifetime, and excellent visibility under bright day-light. Several LED based displays have been developed in recent years using both passive matrix (PM) and active matrix (AM) programming...
In this work we consider the suitability of Phyiscaly Unclonable Functions (PUFs) for high-security applications. For PUFs to be considered secure in such scenarios they must be resilient to both semi-invasive and fully-invasive attacks. We introduce a new failure analysis technique for semi-invasive, single-trace, backside readout of logic states. We apply this technique to characterize the unique...
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