Search results
Cuprum : czasopismo naukowo-techniczne górnictwa rud > 2019 > nr 3 > 35--42
IEEE Transactions on Electron Devices > 2016 > 63 > 5 > 2009 - 2015
Materials for Advanced Packaging > 77-112
Microelectronic Engineering > 2014 > 120 > Complete > 221-224
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 1 > 133 - 138
Microelectronic Engineering > 2014 > 113 > Complete > 152-156
Microelectronic Engineering > 2013 > 105 > Complete > 91-94
2012 IEEE International Reliability Physics Symposium (IRPS) > 6B.1.1 - 6B.1.5
2012 IEEE International Reliability Physics Symposium (IRPS) > BD.2.1 - BD.2.4
Microelectronic Engineering > 2012 > 92 > Complete > 38-41
IEEE Transactions on Electron Devices > 2012 > 59 > 3 > 770 - 776
Thin Solid Films > 2011 > 520 > 1 > 662-666
Microelectronic Engineering > 2011 > 88 > 8 > 1978-1981
2011 International Reliability Physics Symposium > 2C.2.1 - 2C.2.10
2011 International Reliability Physics Symposium > BD.2.1 - BD.2.5
IEEE Transactions on Device and Materials Reliability > 2011 > 11 > 2 > 273 - 277