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With the development of IC manufacturing industry, plastic encapsulated MOS components have been widely applied. Since higher performance requirement from users, the research on the reliability of plastic encapsulated MOS components is especially important. Through researching the common failure mechanism of plastic encapsulated MOS component, the physical and chemical processes of each failure mechanism...
Main objective of this study is to design and development of multi-die embedded micro wafer level packages (EMWLP) reliability test vehicles. Such as, the laterally placed die EMWLP and the vertically stacked thin die EMWLP. For reliability evaluation, EMWLPs have been subjected to both environmental and mechanical reliability tests as per JEDEC standards. These reliability tests include highly accelerated...
Advanced wafer technology node has moved forward to 40 nm and below with an ultra low-K (ULK) dielectric constant value of 2.5. ULK shows lower mechanical strength and poor adhesion than that of low-K dielectric. Cu/ULK delamination becomes the major concern during the packaging reliability test. After eliminating the Cu/low-K delamination issue, experimental result shows that die crack become another...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Stacked die package is a key technique to meet the requirements of smaller size and higher density of electronic products. Moisture plays an important role in the reliability of electronic devices, especially with high temperature, in which the major failures are from corrosion, delamination and crack. The delamination and crack make the device to be easily weak and sensitive to external environment...
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