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A wideband coplanar waveguide integrated with micro-strip line on a through glass via substrate is presented. The design of the ultra-wideband micro-strip to coplanar waveguide transition, which are used at input/output ports. Vertical via connecting the top coplanar waveguide to the ground plane on the bottom of the substrate to achieve the shortest signal transmission distance. Simulated the maximum...
Through-silicon via (TSV) technology known as the core of the next generation of 3D integration has drawn more and more attention. However, due to its high cost and yield problems, it has not been used widely. Nevertheless, TSV is becoming a main stream interconnect method for CIS (CMOS image sensors) packaging. In order to assess the reliability behavior of typical CMOS image sensor such as delamination...
During laminating of Printed Circuit Boards (PCB) bending stresses in the embedded components can be generated due to pressure induced by the resin flow over them, which can lead to their fracture. In addition, the cooling of the PCB after curing of the resin can be even more important for the loading of the component. Here, the different coefficients of thermal expansion of the involved materials...
This paper firstly summarizes the process flow developed at IMEC to integrate and interconnect thin back-contact solar cells into modules. Secondly, the process flow is simulated by Finite Element Modelling to determine critical process steps that may lead to early failures. A virtual Design of Experiment (DOE) is used to determine the best geometry and materials properties in order to minimise the...
This paper reports on the systematic characterization and modeling of a CMOS-based sensor for high-pressure applications. The sensor consists of an anodically bonded silicon-glass stack comprising an n-type Wheatstone bridge as the piezoresistive stress-sensing element. Surface trenches introduced into the silicon close to the Wheatstone bridge significantly increase the pressure sensitivity of the...
To reduce fuel gas consumption, a planar counter-current micro flame ionization detector (μFID) has been developed for mobile applications. In this work, the effect of flame chamber size on the μFID sensitivity is investigated. An FEM model is presented, which predicts sensitivity. The model shows that smaller chambers result in more confined flammable mixtures. Flame observations...
In this paper, a micromechanical resonator utilizing single crystal Si and CMOS ASIC is presented. First, the critical parameters are optimized by theoretical calculation and fine tuned by finite-element-analysis (FEM). Then, SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the resonator as well as a glass wafer is used as the substrate to support the device, metal...
Measurement of failure strength of brittle material is always a challenge. Silicon die and LCD glass are two major brittle components in electronic products. Both of them may fail when subject to a large stress during manufacturing, assembling and in field. In order to assess the risk of failure, both 3-point bending (3PB) and ball-on-ring (BOR) are employed to measure the flexural strength of silicon...
The impact of singularity points on stress distribution in piezoresistive module is investigated by means of FEM simulation. The strong influence of singularities on stress distribution in silicon-glass interface is presented in this paper.
The manufacturing process of Printed Circuit Boards (PCB) with embedded active components requires several modifications on the build-up layer configuration, including the use of thinner layers and heterogeneous composite materials. From the point of view of second level interconnects the increase in density and complexity of the build-up of electronic board leads to an increase of the total resin-content...
Surface wettability is known that is not only governed by chemical structure but also by the surface geometrical structure. A multiscale approach on rough surface wettability study was presented in this paper. The wettability study of photo-switched trans and cis isomers of azobenzene on different substrates was first calculated by molecular dynamics calculations. Different chemical structures and...
Anodic bonding between glass wafer and Si wafer are widely used for micro-electro-mechanical system (MEMS) device fabrication and packaging due to the good bonding quality. The residual stress in the bonding interface, which results from the different thermal expansion coefficients of the two wafer materials, is depended on the bonding temperature. In MEMS piezoresistive pressure sensor, the residual...
The impact of singularity points on stress distribution in piezoresistive module is investigated by means of FEM simulation. Strong influence of singularities on stress distribution in silicon-glass interface is presented in this paper.
In this work, the excimer-laser-induced crystallization of amorphous silicon (a-Si) films was investigated numerically and experimentally. This study had investigated the effects of irradiating energy density on the grain size and structure by scanning electron microscopy (SEM). In the surface microstructure analysis of the laser-irradiated area, the critical fluences (full-melt threshold, FMT) between...
In this paper, the design, fabrication and initial characterization results of a bidirectional, vibration powered, bulk silicon-based electric energy generator are addressed. The converter is based on an In-Plane Overlap Plate (IPOP) configuration. Its mechanical design is inspired from 2D gyroscope. In most of real systems, the axis of the external vibrations is not known and if we assume that the...
A load cell is a transducer to convert a force into an electrical signal. Compared with widely used strain gauge type load cells, silicon-based capacitive load cell cell can offer advantages such as uniform performance over material property change and stable mechanical property in harsh conditions. Here we present a capacitive type load cell with a load sensitive silicon structure and efficient fabrication...
Glass frit bonding is an important technology for the hermetical encapsulation of microsensors. During the manufacturing process or in application the bonding layer is repeatedly exposed to temperature changes. Therefore a meaningful stability assessment must include temperature dependent fracture toughness parameters. This work shows that the influence of temperature changes on the fracture toughness...
In this paper, detailed 3D FEM thermo-mechanical analysis is performed on a chip stack that utilizes the smart three axis compliant (STAC) interconnect, a TSV based ultra-high density compliant interconnect. These interconnects are microstructurally engineered to accommodate relative displacements between ultra-thin TSV based silicon chips and substrates to which they are bonded without transferring...
This paper presents the design, simulation, fabrication and preliminary test results of a monolithic triaxial micromachined vibratory gyroscope. The device is a monolithic integration of two uniaxial in-plane (x- and y-axis) gyroscopes and one uniaxial out-of-plane (z-axis) gyroscope and the three individual gyroscopes are all actuated by electrostatic force and detected by capacitors. In order to...
We have produced glass substrates with textured tin oxide films for a-Si solar modules. Textured tin oxide films and two undercoating layers are coated using "online CVD", which is superior to a common off-line CVD in view of low cost and energy saving. Two undercoating layers of SnO/sub 2//SiO/sub 2/ have the advantages of color suppression and the uniformity of the reflective color of...
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