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Traditional IC packaging requires chips to be assembled at the same level, while recently thrived 2.5D/3D IC packaging utilizes skyscraper approach to stack various types of chips with diverse functions occupying similarfootprint, and this approach not only can reduce overall package size, but also can improve electrical interconnection performance. The primary difference between 2.5D/3D IC lies in...
Emerging fan-out packages require advances in mold compounds, polymer interfaces to metals and silicon, and innovative processing to reach the required high reliability. In this paper, we discuss the fracture energy for mold compound interface to copper and silicon, and use that information for studying interfacial delamination propagation of mold compound. We have examined mold compound delamination...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. For FOWLP known good bare dies are embedded into mold compound forming a reconfigured wafer. A thin film redistribution layer is applied on the reconfigured wafer routes the die pads to the space around the die on the mold compound (fan-out). After solder ball placement and package singulation by dicing...
Fan-out wafer-level-packaging (FO-WLP) technology gets more and more significant attention with its advantages of small form factor, higher I/O density, cost effective and high performance for wide range application. However, wafer warpage is still one critical issue which is needed to be addressed for successful subsequent processes for FO-WLP packaging. In this study, methodology to reduce wafer...
This paper introduces a new encapsulated WLCSP product (eWLCS). The new product has a thin protective coating applied to all exposed silicon surfaces on the die. The applied coating protects the silicon and fragile dielectrics and prevents handling damage during dicing and assembly operations, effectively providing a durable packaged part in the form factor of a WLCSP. The manufacturing process leverages...
This paper is to study the warpage impact of filler content and special additives on BGA packages. The special additives have significant impact on the warpage. The additive A has great influence on the warpage at different temperature; the warpage will flatten when more additive A is added. From the warpage study of single unit from room temperature to 260degC, all the warpage is in 50um when additive...
The challenges of deriving early-adopter competitive advantage, even with fabless access to process technology, through leveraging features offered by the advanced, and possibly disruptive, process technologies in real SoC products, are outlined. A structured methodology for addressing these challenges, and bridging the gap between process and design, sufficiently early in the development cycle to...
Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
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