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with the extending of the storage space capacity of semiconductor device, more and more important data in the business have been accumulated in the device. Thus, the security enhancement becomes the crucial thing must be solved. Fingerprint, due to its properties of “unique by individual” and “unchangeable through life” as well as free from entering password turns into the first choice of personal...
In this paper, different type of wax, wax content and hot hardness at 175°C on the release force and adhesion of molding compound were studied, The studies reveal that the hot hardness is playing a very important role to balance the conflict of reliability and moldability. With higher hot hardness of epoxy molding compound, the release force can be kept at same level with less wax content which can...
Epoxy molding compound for LED bracket, with the merits of good resistance to heat and light damage as well as good reliability and warpage compared to traditional thermoplastic reflecting materials for LED bracket, such as Polyphthalamide (PPA) and Poly1,4-cyclohexylene dimethylene terephthalate (PCT), has becoming the focus of researchers. Here we studied the reflectance of the white epoxy molding...
With the rapid development of the advance integrated circuit (IC) packaging, adhesion between epoxy molding compound (EMC) and leadframes has been defined as one of the most key factors influencing the reliability of integrated circuit, especially with the packages with the Pd(PPF's) pated leadframes. The objective of this work was to study an epoxy molding compound with high adhesion on PPFs as well...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the requirement of the high O/I function. Followed on, warpage has emerged as a big challenge during cutting and surface mounting process. As packing material, Epoxy molding compound (EMC) often show different performance...
The effects of filler loading, types of rubber (elastomer) and glass transition temperature (Tg) on mold compound's toughness at room and high temperature (240°C) were investigated. The new simplified toughness test method based on ASTMD5049 was also developed. The study was done with L39 Taguchi method, 3 factors with 3 levels. The factors are filler percentage (88%,89% and 90%,) Tg value (defined...
The market demand of discrete is very big in semiconductor package. A lot of discrete package is transferring to green compound which are surface mounting design and high voltage power application. It must pass the relative electrical performance and standard JEDEC Level testing. Currently green molding compound always meet some H(3)TRB failure on high voltage device and delamination issue after MSL1...
This paper is to study the warpage impact of filler content and special additives on BGA packages. The special additives have significant impact on the warpage. The additive A has great influence on the warpage at different temperature; the warpage will flatten when more additive A is added. From the warpage study of single unit from room temperature to 260degC, all the warpage is in 50um when additive...
Thermal stress in a semiconductor package is one of the major causes of delamination during stress testing. The influence of epoxy molding compound (EMC) properties on package interfacial stress was studied in this paper. Stress index was calculated based on the tested EMC properties. It was found that there is optimized filler content to get the lowest stress. Type of stress modifier is another important...
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